JPWO2023032748A1 - - Google Patents
Info
- Publication number
- JPWO2023032748A1 JPWO2023032748A1 JP2023545472A JP2023545472A JPWO2023032748A1 JP WO2023032748 A1 JPWO2023032748 A1 JP WO2023032748A1 JP 2023545472 A JP2023545472 A JP 2023545472A JP 2023545472 A JP2023545472 A JP 2023545472A JP WO2023032748 A1 JPWO2023032748 A1 JP WO2023032748A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021139948 | 2021-08-30 | ||
PCT/JP2022/031681 WO2023032748A1 (ja) | 2021-08-30 | 2022-08-23 | 放熱回路基板、放熱部材、及び放熱回路基板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2023032748A1 true JPWO2023032748A1 (ja) | 2023-03-09 |
Family
ID=85412570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023545472A Pending JPWO2023032748A1 (ja) | 2021-08-30 | 2022-08-23 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP4398292A1 (ja) |
JP (1) | JPWO2023032748A1 (ja) |
KR (1) | KR20240049513A (ja) |
CN (1) | CN117321755A (ja) |
WO (1) | WO2023032748A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09194254A (ja) * | 1996-01-17 | 1997-07-29 | Fuji Electric Co Ltd | 半導体装置用基板 |
JP2012212788A (ja) | 2011-03-31 | 2012-11-01 | Dowa Holdings Co Ltd | 金属ベース基板およびその製造方法 |
JP5954374B2 (ja) | 2014-08-08 | 2016-07-20 | 富士電機株式会社 | 絶縁基板、その製造方法、半導体モジュールおよび半導体装置 |
JP6526995B2 (ja) * | 2015-03-25 | 2019-06-05 | 京セラ株式会社 | 放熱基板 |
JP7126107B2 (ja) | 2017-02-28 | 2022-08-26 | 株式会社Flosfia | 成膜方法 |
JP6790945B2 (ja) | 2017-03-17 | 2020-11-25 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法、及び、ヒートシンク付き絶縁回路基板の製造方法 |
JP7064723B2 (ja) | 2017-03-31 | 2022-05-11 | 株式会社Flosfia | 成膜方法 |
WO2021261453A1 (ja) * | 2020-06-22 | 2021-12-30 | デンカ株式会社 | セラミック焼結体、基板、及び、セラミック焼結体の電気絶縁性を高くする方法 |
-
2022
- 2022-08-23 CN CN202280033622.7A patent/CN117321755A/zh active Pending
- 2022-08-23 JP JP2023545472A patent/JPWO2023032748A1/ja active Pending
- 2022-08-23 KR KR1020237037559A patent/KR20240049513A/ko unknown
- 2022-08-23 WO PCT/JP2022/031681 patent/WO2023032748A1/ja active Application Filing
- 2022-08-23 EP EP22864332.6A patent/EP4398292A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20240049513A (ko) | 2024-04-16 |
CN117321755A (zh) | 2023-12-29 |
WO2023032748A1 (ja) | 2023-03-09 |
EP4398292A1 (en) | 2024-07-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230928 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20230928 |