JPWO2023032723A5 - - Google Patents

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Publication number
JPWO2023032723A5
JPWO2023032723A5 JP2022561563A JP2022561563A JPWO2023032723A5 JP WO2023032723 A5 JPWO2023032723 A5 JP WO2023032723A5 JP 2022561563 A JP2022561563 A JP 2022561563A JP 2022561563 A JP2022561563 A JP 2022561563A JP WO2023032723 A5 JPWO2023032723 A5 JP WO2023032723A5
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JP
Japan
Prior art keywords
curable resin
resin composition
composition according
inorganic filler
dispersant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022561563A
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English (en)
Japanese (ja)
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JPWO2023032723A1 (cg-RX-API-DMAC7.html
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Priority claimed from PCT/JP2022/031479 external-priority patent/WO2023032723A1/ja
Publication of JPWO2023032723A1 publication Critical patent/JPWO2023032723A1/ja
Publication of JPWO2023032723A5 publication Critical patent/JPWO2023032723A5/ja
Pending legal-status Critical Current

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JP2022561563A 2021-09-02 2022-08-22 Pending JPWO2023032723A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021143094 2021-09-02
PCT/JP2022/031479 WO2023032723A1 (ja) 2021-09-02 2022-08-22 硬化性樹脂組成物及び層間絶縁材料

Publications (2)

Publication Number Publication Date
JPWO2023032723A1 JPWO2023032723A1 (cg-RX-API-DMAC7.html) 2023-03-09
JPWO2023032723A5 true JPWO2023032723A5 (cg-RX-API-DMAC7.html) 2024-05-24

Family

ID=85412515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022561563A Pending JPWO2023032723A1 (cg-RX-API-DMAC7.html) 2021-09-02 2022-08-22

Country Status (3)

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JP (1) JPWO2023032723A1 (cg-RX-API-DMAC7.html)
TW (1) TW202323380A (cg-RX-API-DMAC7.html)
WO (1) WO2023032723A1 (cg-RX-API-DMAC7.html)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI616398B (zh) * 2011-11-29 2018-03-01 Mitsubishi Chemical Corporation 含有氮化硼之組成物、以及具有由該組成物所構成的層之三維積體電路
JP2015065368A (ja) * 2013-09-26 2015-04-09 日東電工株式会社 樹脂シート及び電子デバイスパッケージの製造方法
KR102196881B1 (ko) * 2017-12-11 2020-12-30 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체
JP6914309B2 (ja) * 2019-10-31 2021-08-04 三菱電機株式会社 シート型絶縁ワニス及びその製造方法、電気機器、並びに回転電機

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