JPWO2023032721A1 - - Google Patents

Info

Publication number
JPWO2023032721A1
JPWO2023032721A1 JP2023545456A JP2023545456A JPWO2023032721A1 JP WO2023032721 A1 JPWO2023032721 A1 JP WO2023032721A1 JP 2023545456 A JP2023545456 A JP 2023545456A JP 2023545456 A JP2023545456 A JP 2023545456A JP WO2023032721 A1 JPWO2023032721 A1 JP WO2023032721A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023545456A
Other languages
Japanese (ja)
Other versions
JP7513215B2 (ja
JPWO2023032721A5 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023032721A1 publication Critical patent/JPWO2023032721A1/ja
Publication of JPWO2023032721A5 publication Critical patent/JPWO2023032721A5/ja
Application granted granted Critical
Publication of JP7513215B2 publication Critical patent/JP7513215B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
JP2023545456A 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法 Active JP7513215B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021139521 2021-08-30
JP2021139521 2021-08-30
PCT/JP2022/031468 WO2023032721A1 (ja) 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023032721A1 true JPWO2023032721A1 (ko) 2023-03-09
JPWO2023032721A5 JPWO2023032721A5 (ko) 2023-12-04
JP7513215B2 JP7513215B2 (ja) 2024-07-09

Family

ID=85412512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023545456A Active JP7513215B2 (ja) 2021-08-30 2022-08-19 基板保持装置、及び導電膜付き基板の製造方法

Country Status (2)

Country Link
JP (1) JP7513215B2 (ko)
WO (1) WO2023032721A1 (ko)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08313856A (ja) * 1995-05-18 1996-11-29 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP4601932B2 (ja) * 2003-09-16 2010-12-22 大日本印刷株式会社 基板収納ケース
JP2006328518A (ja) * 2005-05-30 2006-12-07 Optrex Corp スパッタ成膜装置
JP4417397B2 (ja) * 2007-03-16 2010-02-17 シノン電気産業株式会社 半導体集積回路用トレー
JP2011214034A (ja) * 2010-03-31 2011-10-27 Seiko Epson Corp スパッタ装置
US20140272684A1 (en) * 2013-03-12 2014-09-18 Applied Materials, Inc. Extreme ultraviolet lithography mask blank manufacturing system and method of operation therefor
JP2015175865A (ja) * 2014-03-13 2015-10-05 セイコーエプソン株式会社 光学部品、光学部品の製造方法、電子機器、および移動体
JP2016092025A (ja) * 2014-10-29 2016-05-23 東レエンジニアリング株式会社 基板保持装置および方法ならびに基板検査装置

Also Published As

Publication number Publication date
WO2023032721A1 (ja) 2023-03-09
JP7513215B2 (ja) 2024-07-09

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