JPWO2023026803A1 - - Google Patents

Info

Publication number
JPWO2023026803A1
JPWO2023026803A1 JP2023543780A JP2023543780A JPWO2023026803A1 JP WO2023026803 A1 JPWO2023026803 A1 JP WO2023026803A1 JP 2023543780 A JP2023543780 A JP 2023543780A JP 2023543780 A JP2023543780 A JP 2023543780A JP WO2023026803 A1 JPWO2023026803 A1 JP WO2023026803A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023543780A
Other languages
Japanese (ja)
Other versions
JPWO2023026803A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023026803A1 publication Critical patent/JPWO2023026803A1/ja
Publication of JPWO2023026803A5 publication Critical patent/JPWO2023026803A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/514Gate electrodes for field-effect devices for FETs for IGFETs characterised by the insulating layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
JP2023543780A 2021-08-25 2022-08-03 Pending JPWO2023026803A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021137290 2021-08-25
PCT/JP2022/029771 WO2023026803A1 (ja) 2021-08-25 2022-08-03 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023026803A1 true JPWO2023026803A1 (https=) 2023-03-02
JPWO2023026803A5 JPWO2023026803A5 (https=) 2024-05-20

Family

ID=85323134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023543780A Pending JPWO2023026803A1 (https=) 2021-08-25 2022-08-03

Country Status (5)

Country Link
US (1) US20240332414A1 (https=)
JP (1) JPWO2023026803A1 (https=)
CN (1) CN117716512A (https=)
DE (1) DE112022004091T5 (https=)
WO (1) WO2023026803A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025049885A (ja) * 2023-09-22 2025-04-04 株式会社東芝 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10127885B4 (de) * 2001-06-08 2009-09-24 Infineon Technologies Ag Trench-Leistungshalbleiterbauelement
JP3708057B2 (ja) * 2001-07-17 2005-10-19 株式会社東芝 高耐圧半導体装置
DE112009005538B3 (de) * 2009-07-15 2020-02-13 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung
JP5881322B2 (ja) * 2011-04-06 2016-03-09 ローム株式会社 半導体装置
EP2782130B1 (en) * 2011-11-14 2020-01-08 Fuji Electric Co., Ltd. High-voltage-resistance semiconductor device
JP5812029B2 (ja) 2012-06-13 2015-11-11 株式会社デンソー 炭化珪素半導体装置およびその製造方法
US9257511B2 (en) * 2013-03-26 2016-02-09 Infineon Technologies Ag Silicon carbide device and a method for forming a silicon carbide device
DE112015004374B4 (de) * 2014-09-26 2019-02-14 Mitsubishi Electric Corporation Halbleitervorrichtung
JP6404697B2 (ja) * 2014-12-10 2018-10-10 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
CN107112353B (zh) * 2014-12-23 2020-12-22 Abb电网瑞士股份公司 反向传导半导体装置
JP6260553B2 (ja) * 2015-02-27 2018-01-17 豊田合成株式会社 半導体装置およびその製造方法
JP6611960B2 (ja) * 2016-11-01 2019-11-27 三菱電機株式会社 炭化珪素半導体装置および電力変換装置
JP7237411B2 (ja) 2020-03-04 2023-03-13 株式会社藤商事 遊技機
CN115917757A (zh) * 2020-07-31 2023-04-04 罗姆股份有限公司 SiC半导体装置

Also Published As

Publication number Publication date
US20240332414A1 (en) 2024-10-03
DE112022004091T5 (de) 2024-06-20
CN117716512A (zh) 2024-03-15
WO2023026803A1 (ja) 2023-03-02

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