JPWO2023013538A1 - - Google Patents

Info

Publication number
JPWO2023013538A1
JPWO2023013538A1 JP2023540313A JP2023540313A JPWO2023013538A1 JP WO2023013538 A1 JPWO2023013538 A1 JP WO2023013538A1 JP 2023540313 A JP2023540313 A JP 2023540313A JP 2023540313 A JP2023540313 A JP 2023540313A JP WO2023013538 A1 JPWO2023013538 A1 JP WO2023013538A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023540313A
Other languages
Japanese (ja)
Other versions
JPWO2023013538A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023013538A1 publication Critical patent/JPWO2023013538A1/ja
Publication of JPWO2023013538A5 publication Critical patent/JPWO2023013538A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0049—Casings being metallic containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Textile Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023540313A 2021-08-05 2022-07-29 Pending JPWO2023013538A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021129206 2021-08-05
PCT/JP2022/029246 WO2023013538A1 (ja) 2021-08-05 2022-07-29 電磁シールド及び通信ユニット

Publications (2)

Publication Number Publication Date
JPWO2023013538A1 true JPWO2023013538A1 (https=) 2023-02-09
JPWO2023013538A5 JPWO2023013538A5 (https=) 2024-04-30

Family

ID=85154724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023540313A Pending JPWO2023013538A1 (https=) 2021-08-05 2022-07-29

Country Status (4)

Country Link
US (1) US20240349470A1 (https=)
JP (1) JPWO2023013538A1 (https=)
CN (1) CN117730632A (https=)
WO (1) WO2023013538A1 (https=)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6190834U (https=) * 1984-11-15 1986-06-12
US5298708A (en) * 1991-02-07 1994-03-29 Minnesota Mining And Manufacturing Company Microwave-active tape having a cured polyolefin pressure-sensitive adhesive layer
JP3585561B2 (ja) * 1994-11-25 2004-11-04 大王製紙株式会社 洗濯用タグ、洗濯用タグシートおよびその製造方法
JP3046344U (ja) * 1997-08-18 1998-03-06 株式会社日本能率協会マネジメントセンター カレンダー
JP2000022382A (ja) * 1998-06-30 2000-01-21 Tomoegawa Paper Co Ltd 建築物用電磁波シールド材
JP3074833U (ja) * 2000-07-13 2001-01-26 株式会社サンワケミカ 防犯用粘着シート
CA2460248A1 (en) * 2001-09-14 2003-03-27 Lintec Corporation Easily applicable adhesive sheet and method for producing the same
US7304250B2 (en) * 2002-08-08 2007-12-04 Dai Nippon Printing Co., Ltd. Electromagnetic shielding sheet
KR20080025062A (ko) * 2005-06-02 2008-03-19 도판 인사츠 가부시키가이샤 전자파 실드성 광 투과 부재 및 그 제조 방법
US20100035494A1 (en) * 2006-09-29 2010-02-11 Denki Kagaku Kogyo Kabushiki Kaisha Highly thermally conductive acrylic adhesive sheet
JP5105969B2 (ja) * 2007-06-26 2012-12-26 河村電器産業株式会社 通信機器取り付け方法
JP2009296202A (ja) * 2008-06-04 2009-12-17 Seiko Epson Corp 電子機器の位置管理システム
CN102241950A (zh) * 2010-05-14 2011-11-16 3M创新有限公司 电磁屏蔽胶带
KR101511284B1 (ko) * 2012-06-04 2015-04-10 주식회사 아모그린텍 전도성 점착 테이프 및 그 제조방법
DE102012018368A1 (de) * 2012-09-18 2014-03-20 Cornelius Lungu Hybride schalldämmende Strukturen und deren Anwendungen
CN203238207U (zh) * 2012-12-31 2013-10-16 东莞市美厚塑磁有限公司 一种超薄电磁屏蔽磁性胶片
CN209527065U (zh) * 2018-11-19 2019-10-22 上海威斯科电子材料有限公司 一种电磁屏蔽片
CN113195223A (zh) * 2018-12-20 2021-07-30 琳得科株式会社 端子保护用双面胶带及带电磁波屏蔽膜的半导体装置的制造方法
JP7336732B2 (ja) * 2019-03-27 2023-09-01 パナソニックＩｐマネジメント株式会社 無線通信装置、路側機および無線通信方法
JP7418923B2 (ja) * 2019-04-26 2024-01-22 株式会社イノアックコーポレーション 電磁波シールド材及び電磁波シールド材の製造方法

Also Published As

Publication number Publication date
CN117730632A (zh) 2024-03-19
WO2023013538A1 (ja) 2023-02-09
US20240349470A1 (en) 2024-10-17

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Effective date: 20240124