JPWO2023008049A5 - - Google Patents
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- Publication number
- JPWO2023008049A5 JPWO2023008049A5 JP2023538354A JP2023538354A JPWO2023008049A5 JP WO2023008049 A5 JPWO2023008049 A5 JP WO2023008049A5 JP 2023538354 A JP2023538354 A JP 2023538354A JP 2023538354 A JP2023538354 A JP 2023538354A JP WO2023008049 A5 JPWO2023008049 A5 JP WO2023008049A5
- Authority
- JP
- Japan
- Prior art keywords
- cured product
- producing
- product according
- film
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 claims 22
- 238000010438 heat treatment Methods 0.000 claims 13
- 239000011342 resin composition Substances 0.000 claims 11
- 239000011347 resin Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 9
- 125000000962 organic group Chemical group 0.000 claims 6
- 239000002243 precursor Substances 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 3
- 238000009835 boiling Methods 0.000 claims 2
- 238000007363 ring formation reaction Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- 239000003504 photosensitizing agent Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021125979 | 2021-07-30 | ||
| PCT/JP2022/025647 WO2023008049A1 (ja) | 2021-07-30 | 2022-06-28 | 硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、樹脂組成物、硬化物、積層体、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008049A1 JPWO2023008049A1 (enrdf_load_stackoverflow) | 2023-02-02 |
| JPWO2023008049A5 true JPWO2023008049A5 (enrdf_load_stackoverflow) | 2024-04-26 |
Family
ID=85087875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538354A Pending JPWO2023008049A1 (enrdf_load_stackoverflow) | 2021-07-30 | 2022-06-28 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023008049A1 (enrdf_load_stackoverflow) |
| KR (1) | KR20240027107A (enrdf_load_stackoverflow) |
| CN (1) | CN117730280A (enrdf_load_stackoverflow) |
| TW (1) | TW202305016A (enrdf_load_stackoverflow) |
| WO (1) | WO2023008049A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025063183A1 (ja) * | 2023-09-22 | 2025-03-27 | 富士フイルム株式会社 | 積層体及び積層体の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2635901B2 (ja) * | 1992-03-13 | 1997-07-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ポリイミドのネガティブ像形成方法 |
| KR101985215B1 (ko) * | 2015-05-29 | 2019-06-03 | 후지필름 가부시키가이샤 | 폴리이미드 전구체 조성물, 감광성 수지 조성물, 경화막, 경화막의 제조 방법, 반도체 디바이스 및 폴리이미드 전구체 조성물의 제조 방법 |
| TWI758415B (zh) * | 2017-02-20 | 2022-03-21 | 日商富士軟片股份有限公司 | 感光性樹脂組成物、含雜環聚合物前體、硬化膜、積層體、硬化膜的製造方法及半導體裝置 |
| JP7405088B2 (ja) * | 2018-10-03 | 2023-12-26 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
| JP7370229B2 (ja) | 2018-12-28 | 2023-10-27 | 旭化成株式会社 | 半導体装置、及びその製造方法 |
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2022
- 2022-06-28 JP JP2023538354A patent/JPWO2023008049A1/ja active Pending
- 2022-06-28 CN CN202280053084.8A patent/CN117730280A/zh active Pending
- 2022-06-28 KR KR1020247003472A patent/KR20240027107A/ko active Pending
- 2022-06-28 WO PCT/JP2022/025647 patent/WO2023008049A1/ja active Application Filing
- 2022-07-05 TW TW111125199A patent/TW202305016A/zh unknown