JPWO2023007923A1 - - Google Patents

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Publication number
JPWO2023007923A1
JPWO2023007923A1 JP2023538297A JP2023538297A JPWO2023007923A1 JP WO2023007923 A1 JPWO2023007923 A1 JP WO2023007923A1 JP 2023538297 A JP2023538297 A JP 2023538297A JP 2023538297 A JP2023538297 A JP 2023538297A JP WO2023007923 A1 JPWO2023007923 A1 JP WO2023007923A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023538297A
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Japanese (ja)
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JP7726277B2 (ja
JPWO2023007923A5 (https=
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Publication of JPWO2023007923A1 publication Critical patent/JPWO2023007923A1/ja
Publication of JPWO2023007923A5 publication Critical patent/JPWO2023007923A5/ja
Application granted granted Critical
Publication of JP7726277B2 publication Critical patent/JP7726277B2/ja
Active legal-status Critical Current
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Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1236—Ceramic dielectrics characterised by the ceramic dielectric material based on zirconium oxides or zirconates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2023538297A 2021-07-30 2022-05-23 積層セラミックコンデンサ、回路モジュール、および、回路モジュールの製造方法 Active JP7726277B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021125896 2021-07-30
JP2021125896 2021-07-30
PCT/JP2022/021066 WO2023007923A1 (ja) 2021-07-30 2022-05-23 積層セラミックコンデンサ、回路モジュール、および、回路モジュールの製造方法

Publications (3)

Publication Number Publication Date
JPWO2023007923A1 true JPWO2023007923A1 (https=) 2023-02-02
JPWO2023007923A5 JPWO2023007923A5 (https=) 2024-04-19
JP7726277B2 JP7726277B2 (ja) 2025-08-20

Family

ID=85086499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538297A Active JP7726277B2 (ja) 2021-07-30 2022-05-23 積層セラミックコンデンサ、回路モジュール、および、回路モジュールの製造方法

Country Status (4)

Country Link
US (1) US20240170221A1 (https=)
JP (1) JP7726277B2 (https=)
CN (1) CN117730383A (https=)
WO (1) WO2023007923A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332654A (ja) * 2000-03-17 2001-11-30 Matsushita Electric Ind Co Ltd 電気素子内蔵モジュール及びその製造方法
JP2002299496A (ja) * 2001-03-30 2002-10-11 Fujitsu Ltd 半導体装置及びその製造方法
JP2010258070A (ja) * 2009-04-22 2010-11-11 Murata Mfg Co Ltd 積層型セラミック電子部品
JP2015053469A (ja) * 2013-08-07 2015-03-19 日東電工株式会社 半導体パッケージの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724498B2 (en) * 2006-06-30 2010-05-25 Intel Corporation Low inductance capacitors, methods of assembling same, and systems containing same
JP5029662B2 (ja) * 2009-08-25 2012-09-19 Ｔｄｋ株式会社 コンデンサアレイの実装方法
JP2012156193A (ja) * 2011-01-24 2012-08-16 Tdk Corp 積層コンデンサ
KR101862396B1 (ko) * 2011-09-08 2018-05-30 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
JP5853976B2 (ja) * 2012-06-12 2016-02-09 株式会社村田製作所 積層コンデンサ
KR102016485B1 (ko) * 2014-07-28 2019-09-02 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR102150557B1 (ko) * 2015-03-13 2020-09-01 삼성전기주식회사 적층 세라믹 전자부품, 그 제조방법 및 전자부품이 실장된 회로기판
US10925164B2 (en) * 2016-09-23 2021-02-16 Apple Inc. Stackable passive component
CN110622267A (zh) * 2017-05-15 2019-12-27 阿维科斯公司 多层电容器和包括其的电路板
CN110800076B (zh) * 2017-06-29 2022-12-20 京瓷Avx元器件公司 表面安装的多层耦合电容器和包含该电容器的电路板
JP2020136533A (ja) * 2019-02-21 2020-08-31 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの実装構造
KR102842070B1 (ko) * 2021-01-21 2025-08-04 삼성전기주식회사 세라믹 전자 부품
JP2023158299A (ja) * 2022-04-18 2023-10-30 太陽誘電株式会社 積層セラミック電子部品、回路基板及び積層セラミック電子部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332654A (ja) * 2000-03-17 2001-11-30 Matsushita Electric Ind Co Ltd 電気素子内蔵モジュール及びその製造方法
JP2002299496A (ja) * 2001-03-30 2002-10-11 Fujitsu Ltd 半導体装置及びその製造方法
JP2010258070A (ja) * 2009-04-22 2010-11-11 Murata Mfg Co Ltd 積層型セラミック電子部品
JP2015053469A (ja) * 2013-08-07 2015-03-19 日東電工株式会社 半導体パッケージの製造方法

Also Published As

Publication number Publication date
JP7726277B2 (ja) 2025-08-20
KR20240023441A (ko) 2024-02-21
WO2023007923A1 (ja) 2023-02-02
CN117730383A (zh) 2024-03-19
US20240170221A1 (en) 2024-05-23

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