JPWO2023002766A1 - - Google Patents

Info

Publication number
JPWO2023002766A1
JPWO2023002766A1 JP2023536642A JP2023536642A JPWO2023002766A1 JP WO2023002766 A1 JPWO2023002766 A1 JP WO2023002766A1 JP 2023536642 A JP2023536642 A JP 2023536642A JP 2023536642 A JP2023536642 A JP 2023536642A JP WO2023002766 A1 JPWO2023002766 A1 JP WO2023002766A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023536642A
Other versions
JPWO2023002766A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023002766A1 publication Critical patent/JPWO2023002766A1/ja
Publication of JPWO2023002766A5 publication Critical patent/JPWO2023002766A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2023536642A 2021-07-20 2022-06-07 Pending JPWO2023002766A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021119547 2021-07-20
PCT/JP2022/022932 WO2023002766A1 (ja) 2021-07-20 2022-06-07 プリント配線板及びプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023002766A1 true JPWO2023002766A1 (ja) 2023-01-26
JPWO2023002766A5 JPWO2023002766A5 (ja) 2023-08-30

Family

ID=84979090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023536642A Pending JPWO2023002766A1 (ja) 2021-07-20 2022-06-07

Country Status (4)

Country Link
US (1) US20240008175A1 (ja)
JP (1) JPWO2023002766A1 (ja)
CN (1) CN116490942A (ja)
WO (1) WO2023002766A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002319761A (ja) * 2001-04-23 2002-10-31 Nitto Denko Corp 配線基板の製造方法
JP2003156844A (ja) * 2001-11-21 2003-05-30 Nitto Denko Corp 感光性樹脂組成物、多孔質樹脂、回路基板および回路付サスペンション基板
JP2011132390A (ja) * 2009-12-25 2011-07-07 Sumitomo Electric Ind Ltd 多孔質ポリイミド形成用樹脂組成物
JP6854505B2 (ja) * 2016-11-30 2021-04-07 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム
JP7103569B2 (ja) * 2017-07-06 2022-07-20 住友電工プリントサーキット株式会社 フレキシブルプリント配線板
JP7346906B2 (ja) * 2019-05-17 2023-09-20 株式会社レゾナック クラックの発生率を予測する方法、クラックの発生を抑制できる樹脂組成物を選定する方法、及び電子部品の製造方法
JP7078016B2 (ja) * 2019-06-17 2022-05-31 株式会社村田製作所 インダクタ部品
JP7454929B2 (ja) * 2019-09-13 2024-03-25 日東電工株式会社 配線回路基板の製造方法

Also Published As

Publication number Publication date
US20240008175A1 (en) 2024-01-04
CN116490942A (zh) 2023-07-25
WO2023002766A1 (ja) 2023-01-26

Similar Documents

Publication Publication Date Title
BR112023005462A2 (ja)
BR112021014123A2 (ja)
BR112023012656A2 (ja)
BR112022009896A2 (ja)
BR112022024743A2 (ja)
BR112023009656A2 (ja)
BR102021018859A2 (ja)
BR102021007058A2 (ja)
BR102020022030A2 (ja)
JPWO2023002766A1 (ja)
BR112023016292A2 (ja)
BR112023004146A2 (ja)
BR112023011539A2 (ja)
BR112023011610A2 (ja)
BR112023008976A2 (ja)
BR112023006729A2 (ja)
BR102021020147A2 (ja)
BR102021018926A2 (ja)
BR102021018167A2 (ja)
BR102021017576A2 (ja)
BR102021016837A2 (ja)
BR102021016551A2 (ja)
BR102021016375A2 (ja)
BR102021016200A2 (ja)
BR112021017747A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230420

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230420

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240409

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240517