JPWO2022264773A1 - - Google Patents

Info

Publication number
JPWO2022264773A1
JPWO2022264773A1 JP2023529739A JP2023529739A JPWO2022264773A1 JP WO2022264773 A1 JPWO2022264773 A1 JP WO2022264773A1 JP 2023529739 A JP2023529739 A JP 2023529739A JP 2023529739 A JP2023529739 A JP 2023529739A JP WO2022264773 A1 JPWO2022264773 A1 JP WO2022264773A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023529739A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022264773A1 publication Critical patent/JPWO2022264773A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C3/00—Measuring distances in line of sight; Optical rangefinders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C3/00—Measuring distances in line of sight; Optical rangefinders
    • G01C3/02—Details
    • G01C3/06—Use of electric means to obtain final indication
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Electromagnetism (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2023529739A 2021-06-16 2022-05-26 Pending JPWO2022264773A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021100462 2021-06-16
PCT/JP2022/021568 WO2022264773A1 (ja) 2021-06-16 2022-05-26 接着状態の検査方法及び光計測装置

Publications (1)

Publication Number Publication Date
JPWO2022264773A1 true JPWO2022264773A1 (enrdf_load_stackoverflow) 2022-12-22

Family

ID=84527378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529739A Pending JPWO2022264773A1 (enrdf_load_stackoverflow) 2021-06-16 2022-05-26

Country Status (2)

Country Link
JP (1) JPWO2022264773A1 (enrdf_load_stackoverflow)
WO (1) WO2022264773A1 (enrdf_load_stackoverflow)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171441A (ja) * 1984-02-16 1985-09-04 Shinkawa Ltd ダイボンド接着状態の検出方法
JPH0989536A (ja) * 1995-09-20 1997-04-04 Nec Corp Ｂｇａ接合部検査装置及び方法
JP2001291936A (ja) * 2000-04-04 2001-10-19 Mitsubishi Electric Corp 半導体装置
JP2003152325A (ja) * 2001-11-13 2003-05-23 Matsushita Electric Ind Co Ltd チップ状電子部品の半田付け方法及びペースト半田形状
JP2007048841A (ja) * 2005-08-08 2007-02-22 Moritex Corp シリコン基板によるチップを基材にバンプ接合した構造体の検査装置
JP2013069889A (ja) * 2011-09-22 2013-04-18 Nec Corp 不良検査装置、部品実装システム、不良検査方法、プログラム
JP2016035398A (ja) * 2014-08-01 2016-03-17 パナソニックＩｐマネジメント株式会社 測距装置および測距方法
JP2017015717A (ja) * 2016-08-24 2017-01-19 Ckd株式会社 半田印刷検査装置及び基板製造システム
JP2020003236A (ja) * 2018-06-25 2020-01-09 株式会社リコー 測距装置、移動体、測距方法、測距システム
JP2020153924A (ja) * 2019-03-22 2020-09-24 株式会社デンソー 測距装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171441A (ja) * 1984-02-16 1985-09-04 Shinkawa Ltd ダイボンド接着状態の検出方法
JPH0989536A (ja) * 1995-09-20 1997-04-04 Nec Corp Ｂｇａ接合部検査装置及び方法
JP2001291936A (ja) * 2000-04-04 2001-10-19 Mitsubishi Electric Corp 半導体装置
JP2003152325A (ja) * 2001-11-13 2003-05-23 Matsushita Electric Ind Co Ltd チップ状電子部品の半田付け方法及びペースト半田形状
JP2007048841A (ja) * 2005-08-08 2007-02-22 Moritex Corp シリコン基板によるチップを基材にバンプ接合した構造体の検査装置
JP2013069889A (ja) * 2011-09-22 2013-04-18 Nec Corp 不良検査装置、部品実装システム、不良検査方法、プログラム
JP2016035398A (ja) * 2014-08-01 2016-03-17 パナソニックＩｐマネジメント株式会社 測距装置および測距方法
JP2017015717A (ja) * 2016-08-24 2017-01-19 Ckd株式会社 半田印刷検査装置及び基板製造システム
JP2020003236A (ja) * 2018-06-25 2020-01-09 株式会社リコー 測距装置、移動体、測距方法、測距システム
JP2020153924A (ja) * 2019-03-22 2020-09-24 株式会社デンソー 測距装置

Also Published As

Publication number Publication date
WO2022264773A1 (ja) 2022-12-22

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