JPWO2022255128A1 - - Google Patents

Info

Publication number
JPWO2022255128A1
JPWO2022255128A1 JP2023525727A JP2023525727A JPWO2022255128A1 JP WO2022255128 A1 JPWO2022255128 A1 JP WO2022255128A1 JP 2023525727 A JP2023525727 A JP 2023525727A JP 2023525727 A JP2023525727 A JP 2023525727A JP WO2022255128 A1 JPWO2022255128 A1 JP WO2022255128A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023525727A
Other versions
JP7568086B2 (ja
JPWO2022255128A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022255128A1 publication Critical patent/JPWO2022255128A1/ja
Publication of JPWO2022255128A5 publication Critical patent/JPWO2022255128A5/ja
Application granted granted Critical
Publication of JP7568086B2 publication Critical patent/JP7568086B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09527—Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023525727A 2021-06-03 2022-05-20 多層基板、多層基板の製造方法及び電子機器 Active JP7568086B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021093364 2021-06-03
JP2021093364 2021-06-03
PCT/JP2022/020959 WO2022255128A1 (ja) 2021-06-03 2022-05-20 多層基板、多層基板の製造方法及び電子機器

Publications (3)

Publication Number Publication Date
JPWO2022255128A1 true JPWO2022255128A1 (ja) 2022-12-08
JPWO2022255128A5 JPWO2022255128A5 (ja) 2024-01-04
JP7568086B2 JP7568086B2 (ja) 2024-10-16

Family

ID=84323198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023525727A Active JP7568086B2 (ja) 2021-06-03 2022-05-20 多層基板、多層基板の製造方法及び電子機器

Country Status (4)

Country Link
US (1) US20240055744A1 (ja)
JP (1) JP7568086B2 (ja)
CN (1) CN117178634A (ja)
WO (1) WO2022255128A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06224528A (ja) * 1993-01-27 1994-08-12 Japan Aviation Electron Ind Ltd 両面フィルム基板及びその製造方法
JP3687041B2 (ja) 1997-04-16 2005-08-24 大日本印刷株式会社 配線基板、配線基板の製造方法、および半導体パッケージ
US7703201B2 (en) * 2004-10-25 2010-04-27 International Business Machines Corporation Method of embedding tamper proof layers and discrete components into printed circuit board stack-up
JP5293060B2 (ja) * 2008-10-02 2013-09-18 株式会社デンソー 多層回路基板およびその製造方法
JP6224528B2 (ja) 2014-06-03 2017-11-01 Kddi株式会社 属性値が付与された情報要素を絞り込んで検索する対話検索プログラム、装置及び方法
JP6048633B1 (ja) 2015-04-09 2016-12-21 株式会社村田製作所 複合伝送線路および電子機器

Also Published As

Publication number Publication date
WO2022255128A1 (ja) 2022-12-08
US20240055744A1 (en) 2024-02-15
JP7568086B2 (ja) 2024-10-16
CN117178634A (zh) 2023-12-05

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