JPWO2022250132A5 - - Google Patents
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- Publication number
- JPWO2022250132A5 JPWO2022250132A5 JP2023524244A JP2023524244A JPWO2022250132A5 JP WO2022250132 A5 JPWO2022250132 A5 JP WO2022250132A5 JP 2023524244 A JP2023524244 A JP 2023524244A JP 2023524244 A JP2023524244 A JP 2023524244A JP WO2022250132 A5 JPWO2022250132 A5 JP WO2022250132A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- manufacturing
- wafer
- film
- adhesive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021090476 | 2021-05-28 | ||
| JP2021090476 | 2021-05-28 | ||
| PCT/JP2022/021688 WO2022250132A1 (ja) | 2021-05-28 | 2022-05-27 | 電子装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022250132A1 JPWO2022250132A1 (cg-RX-API-DMAC7.html) | 2022-12-01 |
| JPWO2022250132A5 true JPWO2022250132A5 (cg-RX-API-DMAC7.html) | 2024-02-29 |
| JP7588226B2 JP7588226B2 (ja) | 2024-11-21 |
Family
ID=84228970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023524244A Active JP7588226B2 (ja) | 2021-05-28 | 2022-05-27 | 電子装置の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12444640B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4350743A4 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7588226B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20240006622A (cg-RX-API-DMAC7.html) |
| CN (1) | CN117461116A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022250132A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3410371B2 (ja) | 1998-08-18 | 2003-05-26 | リンテック株式会社 | ウエハ裏面研削時の表面保護シートおよびその利用方法 |
| JP4027332B2 (ja) * | 2004-03-19 | 2007-12-26 | リンテック株式会社 | 半導体用粘接着シートおよび半導体装置の製造方法 |
| JP2008251934A (ja) * | 2007-03-30 | 2008-10-16 | Lintec Corp | 半導体チップの製造方法 |
| JP6059499B2 (ja) | 2012-10-05 | 2017-01-11 | リンテック株式会社 | 表面保護シート |
| JP5823591B1 (ja) | 2014-10-01 | 2015-11-25 | 古河電気工業株式会社 | 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法 |
| US11183416B2 (en) | 2016-10-03 | 2021-11-23 | Lintec Corporation | Adhesive tape for semiconductor processing, and semiconductor device manufacturing method |
| JP6961387B2 (ja) | 2017-05-19 | 2021-11-05 | 日東電工株式会社 | ダイシングダイボンドフィルム |
| WO2019139055A1 (ja) | 2018-01-12 | 2019-07-18 | 株式会社有沢製作所 | 光硬化性粘着剤組成物及び粘着シート |
| JP7289688B2 (ja) | 2019-03-26 | 2023-06-12 | 日東電工株式会社 | 接着フィルム付きダイシングテープ |
| PH12021553038A1 (en) | 2019-06-03 | 2022-07-25 | Mitsui Chemicals Tohcello Inc | Method for manufacturing electronic device |
| JP7421322B2 (ja) | 2019-12-06 | 2024-01-24 | 株式会社リブドゥコーポレーション | 吸収体およびこれを備えた吸収性物品 |
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2022
- 2022-05-27 CN CN202280038031.9A patent/CN117461116A/zh not_active Withdrawn
- 2022-05-27 KR KR1020237042341A patent/KR20240006622A/ko active Pending
- 2022-05-27 EP EP22811400.5A patent/EP4350743A4/en active Pending
- 2022-05-27 JP JP2023524244A patent/JP7588226B2/ja active Active
- 2022-05-27 WO PCT/JP2022/021688 patent/WO2022250132A1/ja not_active Ceased
- 2022-05-27 US US18/564,379 patent/US12444640B2/en active Active