JPWO2022249736A1 - - Google Patents
Info
- Publication number
- JPWO2022249736A1 JPWO2022249736A1 JP2023524054A JP2023524054A JPWO2022249736A1 JP WO2022249736 A1 JPWO2022249736 A1 JP WO2022249736A1 JP 2023524054 A JP2023524054 A JP 2023524054A JP 2023524054 A JP2023524054 A JP 2023524054A JP WO2022249736 A1 JPWO2022249736 A1 JP WO2022249736A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021087990 | 2021-05-25 | ||
PCT/JP2022/015491 WO2022249736A1 (ja) | 2021-05-25 | 2022-03-29 | 撮像装置および電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022249736A1 true JPWO2022249736A1 (ja) | 2022-12-01 |
Family
ID=84228754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023524054A Pending JPWO2022249736A1 (ja) | 2021-05-25 | 2022-03-29 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20240121531A1 (ja) |
EP (1) | EP4351128A1 (ja) |
JP (1) | JPWO2022249736A1 (ja) |
KR (1) | KR20240011708A (ja) |
CN (1) | CN117413529A (ja) |
TW (1) | TW202304187A (ja) |
WO (1) | WO2022249736A1 (ja) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018148528A (ja) * | 2017-03-09 | 2018-09-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および電子機器 |
JP2021184510A (ja) * | 2018-08-31 | 2021-12-02 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置およびその駆動方法、並びに電子機器 |
JP2020096225A (ja) * | 2018-12-10 | 2020-06-18 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置及び電子機器 |
-
2022
- 2022-03-29 CN CN202280036188.8A patent/CN117413529A/zh active Pending
- 2022-03-29 KR KR1020237040192A patent/KR20240011708A/ko unknown
- 2022-03-29 US US18/554,342 patent/US20240121531A1/en active Pending
- 2022-03-29 JP JP2023524054A patent/JPWO2022249736A1/ja active Pending
- 2022-03-29 WO PCT/JP2022/015491 patent/WO2022249736A1/ja active Application Filing
- 2022-03-29 EP EP22811011.0A patent/EP4351128A1/en active Pending
- 2022-05-05 TW TW111116906A patent/TW202304187A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022249736A1 (ja) | 2022-12-01 |
EP4351128A1 (en) | 2024-04-10 |
TW202304187A (zh) | 2023-01-16 |
US20240121531A1 (en) | 2024-04-11 |
CN117413529A (zh) | 2024-01-16 |
KR20240011708A (ko) | 2024-01-26 |