JPWO2022239553A1 - - Google Patents
Info
- Publication number
- JPWO2022239553A1 JPWO2022239553A1 JP2023520912A JP2023520912A JPWO2022239553A1 JP WO2022239553 A1 JPWO2022239553 A1 JP WO2022239553A1 JP 2023520912 A JP2023520912 A JP 2023520912A JP 2023520912 A JP2023520912 A JP 2023520912A JP WO2022239553 A1 JPWO2022239553 A1 JP WO2022239553A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021081206 | 2021-05-12 | ||
PCT/JP2022/015659 WO2022239553A1 (ja) | 2021-05-12 | 2022-03-29 | アンダーフィル用樹脂組成物並びに電子部品装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022239553A1 true JPWO2022239553A1 (ja) | 2022-11-17 |
Family
ID=84028234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023520912A Pending JPWO2022239553A1 (ja) | 2021-05-12 | 2022-03-29 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2022239553A1 (ja) |
CN (1) | CN117378043A (ja) |
TW (1) | TW202244106A (ja) |
WO (1) | WO2022239553A1 (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6825643B2 (ja) * | 2019-05-13 | 2021-02-03 | 昭和電工マテリアルズ株式会社 | 電子部品用液状樹脂組成物及び電子部品装置 |
-
2022
- 2022-03-29 WO PCT/JP2022/015659 patent/WO2022239553A1/ja active Application Filing
- 2022-03-29 JP JP2023520912A patent/JPWO2022239553A1/ja active Pending
- 2022-03-29 CN CN202280033971.9A patent/CN117378043A/zh active Pending
- 2022-04-11 TW TW111113600A patent/TW202244106A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2022239553A1 (ja) | 2022-11-17 |
CN117378043A (zh) | 2024-01-09 |
TW202244106A (zh) | 2022-11-16 |