JPWO2022224473A1 - - Google Patents

Info

Publication number
JPWO2022224473A1
JPWO2022224473A1 JP2023516027A JP2023516027A JPWO2022224473A1 JP WO2022224473 A1 JPWO2022224473 A1 JP WO2022224473A1 JP 2023516027 A JP2023516027 A JP 2023516027A JP 2023516027 A JP2023516027 A JP 2023516027A JP WO2022224473 A1 JPWO2022224473 A1 JP WO2022224473A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023516027A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022224473A1 publication Critical patent/JPWO2022224473A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2023516027A 2021-04-21 2021-11-16 Pending JPWO2022224473A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021071939 2021-04-21
PCT/JP2021/042015 WO2022224473A1 (ja) 2021-04-21 2021-11-16 配線基板

Publications (1)

Publication Number Publication Date
JPWO2022224473A1 true JPWO2022224473A1 (ja) 2022-10-27

Family

ID=83723461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023516027A Pending JPWO2022224473A1 (ja) 2021-04-21 2021-11-16

Country Status (3)

Country Link
EP (1) EP4325554A1 (ja)
JP (1) JPWO2022224473A1 (ja)
WO (1) WO2022224473A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160344A (ja) * 1991-12-06 1993-06-25 Mitsubishi Materials Corp 膜インダクタンス及びその製造方法
JPH05315732A (ja) * 1992-05-13 1993-11-26 Casio Comput Co Ltd 配線基板の製造方法
JPH0817656A (ja) * 1994-06-29 1996-01-19 T I F:Kk 半導体装置の磁気シールド方式および磁気シールド膜形成方法
JP3055488B2 (ja) * 1997-03-03 2000-06-26 日本電気株式会社 多層プリント基板及びその製造方法
JP2000040893A (ja) * 1998-07-23 2000-02-08 Nippon Paint Co Ltd 電磁波制御積層材及び電子機器
JP4509247B2 (ja) 1999-04-30 2010-07-21 東レ・ダウコーニング株式会社 シリコーン含有ポリイミド樹脂、シリコーン含有ポリアミック酸およびそれらの製造方法
JP2002012667A (ja) 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP2004056144A (ja) * 2002-07-16 2004-02-19 Matsushita Electric Ind Co Ltd プリント配線板
KR101566768B1 (ko) 2008-11-10 2015-11-06 아지노모토 가부시키가이샤 프린트 배선판용 수지 조성물
CN104508005B (zh) 2012-08-29 2017-03-08 松下知识产权经营株式会社 改性聚苯醚、其制造方法、聚苯醚树脂组合物、树脂清漆、预浸料、覆金属箔层压板以及印刷布线板
JP7140175B2 (ja) 2020-11-18 2022-09-21 味の素株式会社 回路基板及びその製造方法

Also Published As

Publication number Publication date
WO2022224473A1 (ja) 2022-10-27
EP4325554A1 (en) 2024-02-21

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