JPWO2022211042A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2022211042A5 JPWO2022211042A5 JP2022562936A JP2022562936A JPWO2022211042A5 JP WO2022211042 A5 JPWO2022211042 A5 JP WO2022211042A5 JP 2022562936 A JP2022562936 A JP 2022562936A JP 2022562936 A JP2022562936 A JP 2022562936A JP WO2022211042 A5 JPWO2022211042 A5 JP WO2022211042A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- adhesive layer
- base material
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims 24
- 239000000463 material Substances 0.000 claims 16
- 239000011888 foil Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 11
- 229910052751 metal Inorganic materials 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000002335 surface treatment layer Substances 0.000 claims 2
- 229920001187 thermosetting polymer Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
Claims (12)
前記基材の接着層側の面には、蒸着膜または表面処理層が配置されており、
前記基材は、低誘電樹脂材料を含有し、
前記接着層は、熱硬化性樹脂を含有し、
前記金属箔の前記接着層側の面の最大高さ粗さ（Ｒｚ）が１０μｍ以下であり、前記基材の前記接着層側の面の最大高さ粗さ（Ｒｚ）が０．１μｍ以上である、プリント配線基板用積層体。 A laminate for a printed wiring board in which a substrate, an adhesive layer, and a metal foil are laminated in this order,
A deposited film or a surface treatment layer is disposed on the adhesive layer side surface of the base material,
The base material contains a low dielectric resin material,
The adhesive layer contains a thermosetting resin,
The maximum height roughness (Rz) of the adhesive layer side surface of the metal foil is 10 μm or less, and the maximum height roughness (Rz) of the adhesive layer side surface of the base material is 0.1 μm or more. A laminate for a printed wiring board.
第２基材と、前記第２基材の両面に配置された第２接着層と、片方の前記第２接着層の前記第２基材とは反対側の面に配置された第２金属箔と、を有する第２プリント配線基板用積層体、を有し、
前記第１プリント配線基板用積層体、および前記第２プリント配線基板用積層体は、前記第２プリント配線基板用積層体の前記第２金属箔が配置されていない側の第２接着層が、前記第１プリント配線基板用積層体の第１金属箔と対向するように配置されている多層プリント配線基板用接合体であって、
前記第１基材の前記第１接着層側の面、および前記第２基材の前記第２接着層側の面には、蒸着膜または表面処理層が配置されており、
前記第１基材および前記第２基材は、低誘電樹脂材料を含有し、
前記第１接着層および第２接着層は、熱硬化性樹脂を含有し、
前記第１金属箔および第２金属箔の前記第１接着層および第２接着層側の面の最大高さ粗さ（Ｒｚ）が１０μｍ以下であり、
前記第１基材および前記第２基材の前記第１接着層および第２接着層側の面の最大高さ粗さ（Ｒｚ）が０．１μｍ以上である、多層プリント配線基板用接合体。 a first substrate, first adhesive layers disposed on both sides of the first substrate, and a first metal foil disposed on a surface of each of the first adhesive layers opposite to the first substrate and a first printed wiring board laminate, and
a second base material, second adhesive layers disposed on both sides of the second base material, and a second metal foil disposed on a surface of one of the second adhesive layers opposite to the second base material and a second printed wiring board laminate having
In the first printed wiring board laminate and the second printed wiring board laminate, the second adhesive layer on the side where the second metal foil of the second printed wiring board laminate is not arranged is A multilayer printed wiring board assembly arranged to face the first metal foil of the first printed wiring board laminate,
A deposited film or a surface treatment layer is disposed on the surface of the first substrate on the side of the first adhesive layer and the surface of the second substrate on the side of the second adhesive layer,
The first base material and the second base material contain a low dielectric resin material,
The first adhesive layer and the second adhesive layer contain a thermosetting resin,
The maximum height roughness (Rz) of the surfaces of the first metal foil and the second metal foil facing the first adhesive layer and the second adhesive layer is 10 μm or less,
A joined body for a multilayer printed wiring board, wherein the maximum height roughness (Rz) of the surfaces of the first base material and the second base material facing the first adhesive layer and the second adhesive layer is 0.1 μm or more.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021060003 | 2021-03-31 | ||
| JP2021060003 | 2021-03-31 | ||
| PCT/JP2022/016605 WO2022211042A1 (en) | 2021-03-31 | 2022-03-31 | Laminate for printed circuit board and junction for multilayer printed circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022211042A1 JPWO2022211042A1 (en) | 2022-10-06 |
| JPWO2022211042A5 true JPWO2022211042A5 (en) | 2023-03-01 |
| JP7298786B2 JP7298786B2 (en) | 2023-06-27 |
Family
ID=83456643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022562936A Active JP7298786B2 (en) | 2021-03-31 | 2022-03-31 | Laminate for printed wiring board and joined body for multilayer printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7298786B2 (en) |
| TW (1) | TW202246053A (en) |
| WO (1) | WO2022211042A1 (en) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136631A (en) | 2001-11-02 | 2003-05-14 | Kanegafuchi Chem Ind Co Ltd | Flexible copper-clad laminated sheet |
| JP2005167172A (en) * | 2003-11-14 | 2005-06-23 | Hitachi Chem Co Ltd | Printed wiring board and its manufacturing method |
| JP4291279B2 (en) * | 2005-01-26 | 2009-07-08 | パナソニック株式会社 | Flexible multilayer circuit board |
| JP2011100846A (en) | 2009-11-05 | 2011-05-19 | Sumitomo Metal Mining Co Ltd | Two-layer flexible board, method of manufacturing the same, two-layer flexible wiring board, method of manufacturing the same, and plasma processing device |
| JP2015115334A (en) | 2013-12-09 | 2015-06-22 | イビデン株式会社 | Printed wiring board and method for manufacturing printed wiring board |
| CN107926115B (en) | 2015-08-17 | 2020-07-24 | 住友电气工业株式会社 | Printed wiring board and electronic component |
| TWI754668B (en) * | 2016-09-05 | 2022-02-11 | 日商荒川化學工業股份有限公司 | Copper clad laminate for flexible printed circuit board and flexible printed circuit board |
| JP6736610B2 (en) | 2017-07-28 | 2020-08-05 | 旭化成株式会社 | Method for manufacturing conductive pattern |
| JP6986926B2 (en) | 2017-10-18 | 2021-12-22 | セイコーインスツル株式会社 | Manufacturing method of tape base material for wiring board and tape base material for wiring board |
| CN111836716B (en) * | 2018-03-30 | 2023-02-24 | 三井金属矿业株式会社 | Copper-clad laminated board |
| JP7178852B2 (en) * | 2018-09-28 | 2022-11-28 | 日東電工株式会社 | Low dielectric substrate material |
-
2022
- 2022-03-31 TW TW111112478A patent/TW202246053A/en unknown
- 2022-03-31 JP JP2022562936A patent/JP7298786B2/en active Active
- 2022-03-31 WO PCT/JP2022/016605 patent/WO2022211042A1/en active Application Filing
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9860978B1 (en) | Rigid-flex board structure | |
| JPWO2006016586A1 (en) | Multilayer printed wiring board manufacturing method and multilayer printed wiring board obtained by the manufacturing method | |
| TW201913835A (en) | Soft and hard bonding board and manufacturing method thereof | |
| US20140186581A1 (en) | Primer-coated copper foil having superior adhesive strength and method for producing the same | |
| CN108882569B (en) | PCB manufacturing method and PCB | |
| JPWO2022211042A5 (en) | ||
| JP2721570B2 (en) | Multi-layer flexible printed wiring board | |
| JP4785473B2 (en) | Multilayer printed wiring board, manufacturing method of multilayer printed wiring board, and electronic device | |
| JP7020754B2 (en) | Flexible printed wiring board | |
| CN219769314U (en) | PBT composite film | |
| JP2818361B2 (en) | Manufacturing method of multilayer printed wiring board | |
| TWM626881U (en) | Thick metal clad laminate manufacturing apparatus | |
| JPWO2021182158A5 (en) | ||
| JP2959818B2 (en) | Release film | |
| BR9306894A (en) | Process for the manufacture of a multilayer printed circuit board | |
| JPH04165690A (en) | Manufacture of single-sided copper-clad laminated board | |
| JPS6032393A (en) | Method of producing multilayer circuit board | |
| TW202440323A (en) | Method for manufacturing circuit substrate and resin sheet with metal foil | |
| JP4694024B2 (en) | Laminate production method | |
| JP2012191101A (en) | Manufacturing method of circuit board | |
| JPS6319246A (en) | Multilayer copper-lined laminated board | |
| KR100332973B1 (en) | Printed circuit board for impedance control | |
| KR19980026419A (en) | Manufacturing method of flexible multilayer printed circuit board with improved surface reliability | |
| KR200272231Y1 (en) | Printed circuit board for impedance control | |
| JP2002353622A5 (en) |