JPWO2022210701A5 - - Google Patents
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- Publication number
- JPWO2022210701A5 JPWO2022210701A5 JP2023511372A JP2023511372A JPWO2022210701A5 JP WO2022210701 A5 JPWO2022210701 A5 JP WO2022210701A5 JP 2023511372 A JP2023511372 A JP 2023511372A JP 2023511372 A JP2023511372 A JP 2023511372A JP WO2022210701 A5 JPWO2022210701 A5 JP WO2022210701A5
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- forming
- expanding
- workpiece
- support sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021062250 | 2021-03-31 | ||
| PCT/JP2022/015411 WO2022210701A1 (ja) | 2021-03-31 | 2022-03-29 | 樹脂膜付き個片化ワーク加工物の製造方法、及び、樹脂膜付き個片化ワーク加工物の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210701A1 JPWO2022210701A1 (zh) | 2022-10-06 |
| JPWO2022210701A5 true JPWO2022210701A5 (zh) | 2024-01-12 |
Family
ID=83456278
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511372A Pending JPWO2022210701A1 (zh) | 2021-03-31 | 2022-03-29 | |
| JP2023511375A Pending JPWO2022210705A1 (zh) | 2021-03-31 | 2022-03-29 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511375A Pending JPWO2022210705A1 (zh) | 2021-03-31 | 2022-03-29 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPWO2022210701A1 (zh) |
| KR (2) | KR20230161991A (zh) |
| CN (2) | CN117099187A (zh) |
| TW (2) | TW202246065A (zh) |
| WO (2) | WO2022210705A1 (zh) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007214457A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Seimitsu Co Ltd | ウェーハ加工装置及び方法 |
| JP6519077B2 (ja) * | 2015-05-25 | 2019-05-29 | リンテック株式会社 | 半導体装置の製造方法 |
| JP6776081B2 (ja) * | 2016-09-28 | 2020-10-28 | リンテック株式会社 | 保護膜付き半導体チップの製造方法及び半導体装置の製造方法 |
| WO2019009123A1 (ja) * | 2017-07-06 | 2019-01-10 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
| WO2020218516A1 (ja) * | 2019-04-26 | 2020-10-29 | リンテック株式会社 | 第三積層体の製造方法 |
-
2022
- 2022-03-29 KR KR1020237033373A patent/KR20230161991A/ko unknown
- 2022-03-29 JP JP2023511372A patent/JPWO2022210701A1/ja active Pending
- 2022-03-29 JP JP2023511375A patent/JPWO2022210705A1/ja active Pending
- 2022-03-29 CN CN202280026479.9A patent/CN117099187A/zh active Pending
- 2022-03-29 KR KR1020237033381A patent/KR20230163418A/ko unknown
- 2022-03-29 CN CN202280026451.5A patent/CN117099186A/zh active Pending
- 2022-03-29 WO PCT/JP2022/015430 patent/WO2022210705A1/ja active Application Filing
- 2022-03-29 WO PCT/JP2022/015411 patent/WO2022210701A1/ja active Application Filing
- 2022-03-30 TW TW111112119A patent/TW202246065A/zh unknown
- 2022-03-30 TW TW111112197A patent/TW202246066A/zh unknown
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