JPWO2022210209A5 - - Google Patents
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- JPWO2022210209A5 JPWO2022210209A5 JP2022554356A JP2022554356A JPWO2022210209A5 JP WO2022210209 A5 JPWO2022210209 A5 JP WO2022210209A5 JP 2022554356 A JP2022554356 A JP 2022554356A JP 2022554356 A JP2022554356 A JP 2022554356A JP WO2022210209 A5 JPWO2022210209 A5 JP WO2022210209A5
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- JP
- Japan
- Prior art keywords
- silicon nitride
- peak
- particle size
- nitride powder
- powder according
- Prior art date
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- 229910052581 Si3N4 Inorganic materials 0.000 claims 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 12
- 239000002245 particle Substances 0.000 claims 11
- 239000000843 powder Substances 0.000 claims 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 238000007561 laser diffraction method Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 238000000790 scattering method Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Claims (9)
レーザー回折・散乱法を用いた粒子径分布測定装置で測定される体積基準の粒子径分布が、第1ピークと、第1ピークよりも大きい粒子径領域に第2ピークとを有し、
前記第1ピークと前記第2ピークとの間の頻度の最低高さ及び前記第1ピークの高さを、それぞれH0及びH1としたときに、H1が4.0~8.0体積%、且つH1/H0が1.6以上であり、
表面酸素量が0.5質量%以上である、窒化ケイ素粉末。 containing primary particles of silicon nitride,
Volume-based particle size distribution measured with a particle size distribution measuring device using a laser diffraction/scattering method has a first peak and a second peak in a particle size region larger than the first peak,
When the minimum height of the frequency between the first peak and the second peak and the height of the first peak are H0 and H1, respectively, H1 is 4.0 to 8.0% by volume, and H1/H0 is 1.6 or more,
A silicon nitride powder having a surface oxygen content of 0.5% by mass or more .
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021057685 | 2021-03-30 | ||
JP2021057685 | 2021-03-30 | ||
PCT/JP2022/013707 WO2022210209A1 (en) | 2021-03-30 | 2022-03-23 | Silicon nitride powder and method for producing silicon nitride sintered body |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022210209A1 JPWO2022210209A1 (en) | 2022-10-06 |
JPWO2022210209A5 true JPWO2022210209A5 (en) | 2023-03-01 |
JP7242972B2 JP7242972B2 (en) | 2023-03-20 |
Family
ID=83456783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022554356A Active JP7242972B2 (en) | 2021-03-30 | 2022-03-23 | Method for producing silicon nitride powder and silicon nitride sintered body |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7242972B2 (en) |
WO (1) | WO2022210209A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3438928B2 (en) * | 1994-01-12 | 2003-08-18 | 電気化学工業株式会社 | Method for producing silicon nitride powder |
JP2002265276A (en) * | 2001-03-07 | 2002-09-18 | Hitachi Metals Ltd | Silicon nitride powder and silicon nitride sintered compact |
CN102206082A (en) * | 2011-03-03 | 2011-10-05 | 北方民族大学 | Method for preparing submicron silicon nitride |
JP2013203613A (en) * | 2012-03-29 | 2013-10-07 | Ube Industries Ltd | Method for controlling silicon nitride powder |
JP6354367B2 (en) * | 2014-06-16 | 2018-07-11 | 宇部興産株式会社 | Silicon nitride powder for release agent of polycrystalline silicon ingot casting mold and manufacturing method thereof, slurry containing silicon nitride powder for release agent of casting mold of polycrystalline silicon ingot, and casting mold for polycrystalline silicon ingot and manufacturing method thereof |
-
2022
- 2022-03-23 WO PCT/JP2022/013707 patent/WO2022210209A1/en active Application Filing
- 2022-03-23 JP JP2022554356A patent/JP7242972B2/en active Active
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