JPWO2022210055A5 - - Google Patents

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Publication number
JPWO2022210055A5
JPWO2022210055A5 JP2023510994A JP2023510994A JPWO2022210055A5 JP WO2022210055 A5 JPWO2022210055 A5 JP WO2022210055A5 JP 2023510994 A JP2023510994 A JP 2023510994A JP 2023510994 A JP2023510994 A JP 2023510994A JP WO2022210055 A5 JPWO2022210055 A5 JP WO2022210055A5
Authority
JP
Japan
Prior art keywords
mass
parts
sensitive adhesive
less
electrically peelable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023510994A
Other languages
English (en)
Japanese (ja)
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JPWO2022210055A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/012878 external-priority patent/WO2022210055A1/ja
Publication of JPWO2022210055A1 publication Critical patent/JPWO2022210055A1/ja
Publication of JPWO2022210055A5 publication Critical patent/JPWO2022210055A5/ja
Pending legal-status Critical Current

Links

JP2023510994A 2021-03-30 2022-03-18 Pending JPWO2022210055A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021057809 2021-03-30
PCT/JP2022/012878 WO2022210055A1 (ja) 2021-03-30 2022-03-18 粘着シート、接合体、及び接合体の分離方法

Publications (2)

Publication Number Publication Date
JPWO2022210055A1 JPWO2022210055A1 (https=) 2022-10-06
JPWO2022210055A5 true JPWO2022210055A5 (https=) 2025-02-25

Family

ID=83456036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023510994A Pending JPWO2022210055A1 (https=) 2021-03-30 2022-03-18

Country Status (2)

Country Link
JP (1) JPWO2022210055A1 (https=)
WO (1) WO2022210055A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4455235A1 (de) * 2023-04-25 2024-10-30 tesa SE Klebeband, verfahren zur herstellung des klebebandes, verklebter verbund und verfahren zum elektrischen lösen des verklebten verbundes

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040112514A1 (en) * 2002-12-16 2004-06-17 Xyron, Inc. Device and method for performing a master processing operation
US8708305B2 (en) * 2010-08-04 2014-04-29 3M Innovative Properties Company Adhesively mounted article support assembly with exposed pull tab
US20150218425A1 (en) * 2014-02-05 2015-08-06 Apple Inc. Stretch release conductive adhesive
JP6318398B2 (ja) * 2014-02-27 2018-05-09 日東電工株式会社 積層体
JP6633339B2 (ja) * 2015-10-14 2020-01-22 日東電工株式会社 タブ付き粘着製品
JP3220121U (ja) * 2018-12-03 2019-02-14 後藤 秀樹 結束テープ
US20220282125A1 (en) * 2019-08-09 2022-09-08 Nitto Denko Corporation Electrical debonding type adhesive sheet, joined body, and method for separating joined body

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