JPWO2022210055A1 - - Google Patents

Info

Publication number
JPWO2022210055A1
JPWO2022210055A1 JP2023510994A JP2023510994A JPWO2022210055A1 JP WO2022210055 A1 JPWO2022210055 A1 JP WO2022210055A1 JP 2023510994 A JP2023510994 A JP 2023510994A JP 2023510994 A JP2023510994 A JP 2023510994A JP WO2022210055 A1 JPWO2022210055 A1 JP WO2022210055A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023510994A
Other languages
Japanese (ja)
Other versions
JPWO2022210055A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022210055A1 publication Critical patent/JPWO2022210055A1/ja
Publication of JPWO2022210055A5 publication Critical patent/JPWO2022210055A5/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023510994A 2021-03-30 2022-03-18 Pending JPWO2022210055A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021057809 2021-03-30
PCT/JP2022/012878 WO2022210055A1 (ja) 2021-03-30 2022-03-18 粘着シート、接合体、及び接合体の分離方法

Publications (2)

Publication Number Publication Date
JPWO2022210055A1 true JPWO2022210055A1 (https=) 2022-10-06
JPWO2022210055A5 JPWO2022210055A5 (https=) 2025-02-25

Family

ID=83456036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023510994A Pending JPWO2022210055A1 (https=) 2021-03-30 2022-03-18

Country Status (2)

Country Link
JP (1) JPWO2022210055A1 (https=)
WO (1) WO2022210055A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4455235A1 (de) * 2023-04-25 2024-10-30 tesa SE Klebeband, verfahren zur herstellung des klebebandes, verklebter verbund und verfahren zum elektrischen lösen des verklebten verbundes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013540457A (ja) * 2010-08-04 2013-11-07 スリーエム イノベイティブ プロパティズ カンパニー 露出したプルタブを備えた接着取り付けされる物品支持アセンブリ
JP2017075231A (ja) * 2015-10-14 2017-04-20 日東電工株式会社 タブ付き粘着製品
JP3220121U (ja) * 2018-12-03 2019-02-14 後藤 秀樹 結束テープ
JP2021028388A (ja) * 2019-08-09 2021-02-25 日東電工株式会社 電気剥離型粘着シート、接合体、および接合体の分離方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040112514A1 (en) * 2002-12-16 2004-06-17 Xyron, Inc. Device and method for performing a master processing operation
US20150218425A1 (en) * 2014-02-05 2015-08-06 Apple Inc. Stretch release conductive adhesive
JP6318398B2 (ja) * 2014-02-27 2018-05-09 日東電工株式会社 積層体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013540457A (ja) * 2010-08-04 2013-11-07 スリーエム イノベイティブ プロパティズ カンパニー 露出したプルタブを備えた接着取り付けされる物品支持アセンブリ
JP2017075231A (ja) * 2015-10-14 2017-04-20 日東電工株式会社 タブ付き粘着製品
JP3220121U (ja) * 2018-12-03 2019-02-14 後藤 秀樹 結束テープ
JP2021028388A (ja) * 2019-08-09 2021-02-25 日東電工株式会社 電気剥離型粘着シート、接合体、および接合体の分離方法

Also Published As

Publication number Publication date
WO2022210055A1 (ja) 2022-10-06

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