JPWO2022209989A1 - - Google Patents
Info
- Publication number
- JPWO2022209989A1 JPWO2022209989A1 JP2023510959A JP2023510959A JPWO2022209989A1 JP WO2022209989 A1 JPWO2022209989 A1 JP WO2022209989A1 JP 2023510959 A JP2023510959 A JP 2023510959A JP 2023510959 A JP2023510959 A JP 2023510959A JP WO2022209989 A1 JPWO2022209989 A1 JP WO2022209989A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021056019 | 2021-03-29 | ||
PCT/JP2022/012432 WO2022209989A1 (ja) | 2021-03-29 | 2022-03-17 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022209989A1 true JPWO2022209989A1 (ja) | 2022-10-06 |
Family
ID=83456155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023510959A Pending JPWO2022209989A1 (ja) | 2021-03-29 | 2022-03-17 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240172359A1 (ja) |
JP (1) | JPWO2022209989A1 (ja) |
KR (1) | KR20230141859A (ja) |
CN (1) | CN117044412A (ja) |
TW (1) | TWI808700B (ja) |
WO (1) | WO2022209989A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5242710B2 (ja) | 2010-01-22 | 2013-07-24 | 古河電気工業株式会社 | 粗化処理銅箔、銅張積層板及びプリント配線板 |
JP5705381B2 (ja) | 2013-02-28 | 2015-04-22 | 三井金属鉱業株式会社 | 黒色化表面処理銅箔、黒色化表面処理銅箔の製造方法、銅張積層板及びフレキシブルプリント配線板 |
JP5710737B1 (ja) * | 2013-11-29 | 2015-04-30 | Jx日鉱日石金属株式会社 | 表面処理銅箔、積層板、プリント配線板、プリント回路板及び電子機器 |
JP6352449B2 (ja) * | 2015-01-22 | 2018-07-04 | 三井金属鉱業株式会社 | キャリア付極薄銅箔及びその製造方法 |
CN107205370A (zh) * | 2015-03-17 | 2017-09-26 | 株式会社艾迪科 | 防虫膜及防虫罩 |
WO2018110579A1 (ja) * | 2016-12-14 | 2018-06-21 | 古河電気工業株式会社 | 表面処理銅箔および銅張積層板 |
JP2020011426A (ja) * | 2018-07-17 | 2020-01-23 | Jx金属株式会社 | 積層体及び放熱部材 |
-
2022
- 2022-03-17 JP JP2023510959A patent/JPWO2022209989A1/ja active Pending
- 2022-03-17 KR KR1020237030359A patent/KR20230141859A/ko unknown
- 2022-03-17 CN CN202280021495.9A patent/CN117044412A/zh active Pending
- 2022-03-17 US US18/284,602 patent/US20240172359A1/en active Pending
- 2022-03-17 WO PCT/JP2022/012432 patent/WO2022209989A1/ja active Application Filing
- 2022-03-29 TW TW111112020A patent/TWI808700B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI808700B (zh) | 2023-07-11 |
TW202244330A (zh) | 2022-11-16 |
WO2022209989A1 (ja) | 2022-10-06 |
CN117044412A (zh) | 2023-11-10 |
KR20230141859A (ko) | 2023-10-10 |
US20240172359A1 (en) | 2024-05-23 |