JPWO2022209571A1 - - Google Patents
Info
- Publication number
- JPWO2022209571A1 JPWO2022209571A1 JP2023510718A JP2023510718A JPWO2022209571A1 JP WO2022209571 A1 JPWO2022209571 A1 JP WO2022209571A1 JP 2023510718 A JP2023510718 A JP 2023510718A JP 2023510718 A JP2023510718 A JP 2023510718A JP WO2022209571 A1 JPWO2022209571 A1 JP WO2022209571A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N2021/1765—Method using an image detector and processing of image signal
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
- H10F39/8023—Disposition of the elements in pixels, e.g. smaller elements in the centre of the imager compared to larger elements at the periphery
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021058329 | 2021-03-30 | ||
| PCT/JP2022/009275 WO2022209571A1 (ja) | 2021-03-30 | 2022-03-04 | 光検出装置および電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209571A1 true JPWO2022209571A1 (https=) | 2022-10-06 |
Family
ID=83458573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510718A Pending JPWO2022209571A1 (https=) | 2021-03-30 | 2022-03-04 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240175802A1 (https=) |
| EP (1) | EP4318591A4 (https=) |
| JP (1) | JPWO2022209571A1 (https=) |
| CN (1) | CN116998017A (https=) |
| WO (1) | WO2022209571A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024038808A (ja) * | 2022-09-08 | 2024-03-21 | キヤノン株式会社 | 光電変換装置、機器および光電変換装置の製造方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002043502A (ja) * | 2000-07-25 | 2002-02-08 | Toshiba Corp | マルチチップ半導体装置、ならびにマルチチップ半導体装置用チップ及びその製造方法 |
| JP2006019455A (ja) * | 2004-06-30 | 2006-01-19 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| US20090085143A1 (en) * | 2007-10-01 | 2009-04-02 | Samsung Electronics Co., Ltd. | Image sensor and method of manufacturing the same |
| JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
| JP2012064709A (ja) * | 2010-09-15 | 2012-03-29 | Sony Corp | 固体撮像装置及び電子機器 |
| JP2012084609A (ja) * | 2010-10-07 | 2012-04-26 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
| JP2013187360A (ja) * | 2012-03-08 | 2013-09-19 | Sony Corp | 固体撮像装置、及び、電子機器 |
| JP2013251539A (ja) * | 2012-05-30 | 2013-12-12 | Samsung Electronics Co Ltd | シリコン貫通ビアの構造物およびその形成方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6353354B2 (ja) * | 2014-12-12 | 2018-07-04 | ルネサスエレクトロニクス株式会社 | 撮像装置およびその製造方法 |
| KR102430496B1 (ko) | 2017-09-29 | 2022-08-08 | 삼성전자주식회사 | 이미지 센싱 장치 및 그 제조 방법 |
| KR102636443B1 (ko) * | 2018-12-12 | 2024-02-15 | 에스케이하이닉스 주식회사 | 노이즈 차단 구조를 포함하는 이미지 센싱 장치 |
-
2022
- 2022-03-04 EP EP22779796.6A patent/EP4318591A4/en active Pending
- 2022-03-04 WO PCT/JP2022/009275 patent/WO2022209571A1/ja not_active Ceased
- 2022-03-04 CN CN202280021887.5A patent/CN116998017A/zh active Pending
- 2022-03-04 US US18/551,671 patent/US20240175802A1/en active Pending
- 2022-03-04 JP JP2023510718A patent/JPWO2022209571A1/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002043502A (ja) * | 2000-07-25 | 2002-02-08 | Toshiba Corp | マルチチップ半導体装置、ならびにマルチチップ半導体装置用チップ及びその製造方法 |
| JP2006019455A (ja) * | 2004-06-30 | 2006-01-19 | Nec Electronics Corp | 半導体装置およびその製造方法 |
| US20090085143A1 (en) * | 2007-10-01 | 2009-04-02 | Samsung Electronics Co., Ltd. | Image sensor and method of manufacturing the same |
| JP2012033894A (ja) * | 2010-06-30 | 2012-02-16 | Canon Inc | 固体撮像装置 |
| JP2012064709A (ja) * | 2010-09-15 | 2012-03-29 | Sony Corp | 固体撮像装置及び電子機器 |
| JP2012084609A (ja) * | 2010-10-07 | 2012-04-26 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
| JP2013187360A (ja) * | 2012-03-08 | 2013-09-19 | Sony Corp | 固体撮像装置、及び、電子機器 |
| JP2013251539A (ja) * | 2012-05-30 | 2013-12-12 | Samsung Electronics Co Ltd | シリコン貫通ビアの構造物およびその形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116998017A (zh) | 2023-11-03 |
| US20240175802A1 (en) | 2024-05-30 |
| WO2022209571A1 (ja) | 2022-10-06 |
| EP4318591A4 (en) | 2024-12-18 |
| TW202247441A (zh) | 2022-12-01 |
| EP4318591A1 (en) | 2024-02-07 |
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