JPWO2022208603A1 - - Google Patents

Info

Publication number
JPWO2022208603A1
JPWO2022208603A1 JP2023509917A JP2023509917A JPWO2022208603A1 JP WO2022208603 A1 JPWO2022208603 A1 JP WO2022208603A1 JP 2023509917 A JP2023509917 A JP 2023509917A JP 2023509917 A JP2023509917 A JP 2023509917A JP WO2022208603 A1 JPWO2022208603 A1 JP WO2022208603A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023509917A
Other versions
JP7438454B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022208603A1 publication Critical patent/JPWO2022208603A1/ja
Application granted granted Critical
Publication of JP7438454B2 publication Critical patent/JP7438454B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023509917A 2021-03-29 2021-03-29 半導体装置 Active JP7438454B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013259 WO2022208603A1 (ja) 2021-03-29 2021-03-29 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022208603A1 true JPWO2022208603A1 (ja) 2022-10-06
JP7438454B2 JP7438454B2 (ja) 2024-02-26

Family

ID=83455713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509917A Active JP7438454B2 (ja) 2021-03-29 2021-03-29 半導体装置

Country Status (5)

Country Link
US (1) US20240071868A1 (ja)
JP (1) JP7438454B2 (ja)
CN (1) CN117043939A (ja)
DE (1) DE112021007408T5 (ja)
WO (1) WO2022208603A1 (ja)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277870U (ja) * 1988-12-02 1990-06-14
JP2850606B2 (ja) * 1991-11-25 1999-01-27 富士電機株式会社 トランジスタモジュール
JP3396566B2 (ja) * 1995-10-25 2003-04-14 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
CN117043939A (zh) 2023-11-10
US20240071868A1 (en) 2024-02-29
WO2022208603A1 (ja) 2022-10-06
DE112021007408T5 (de) 2024-01-18
JP7438454B2 (ja) 2024-02-26

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