JPWO2022202845A1 - - Google Patents

Info

Publication number
JPWO2022202845A1
JPWO2022202845A1 JP2023509214A JP2023509214A JPWO2022202845A1 JP WO2022202845 A1 JPWO2022202845 A1 JP WO2022202845A1 JP 2023509214 A JP2023509214 A JP 2023509214A JP 2023509214 A JP2023509214 A JP 2023509214A JP WO2022202845 A1 JPWO2022202845 A1 JP WO2022202845A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509214A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202845A1 publication Critical patent/JPWO2022202845A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2023509214A 2021-03-26 2022-03-22 Pending JPWO2022202845A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021054376 2021-03-26
PCT/JP2022/013289 WO2022202845A1 (ja) 2021-03-26 2022-03-22 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022202845A1 true JPWO2022202845A1 (zh) 2022-09-29

Family

ID=83395626

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023509214A Pending JPWO2022202845A1 (zh) 2021-03-26 2022-03-22
JP2023509213A Pending JPWO2022202844A1 (zh) 2021-03-26 2022-03-22

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023509213A Pending JPWO2022202844A1 (zh) 2021-03-26 2022-03-22

Country Status (3)

Country Link
JP (2) JPWO2022202845A1 (zh)
TW (2) TW202244238A (zh)
WO (2) WO2022202845A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY185987A (en) * 2015-12-22 2021-06-14 Lintec Corp Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device
WO2018030287A1 (ja) * 2016-08-08 2018-02-15 東レ・ダウコーニング株式会社 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法
TWI815979B (zh) * 2018-09-28 2023-09-21 日商琳得科股份有限公司 硬化性組合物、硬化物及硬化性組合物的使用方法

Also Published As

Publication number Publication date
TW202244237A (zh) 2022-11-16
JPWO2022202844A1 (zh) 2022-09-29
WO2022202844A1 (ja) 2022-09-29
WO2022202845A1 (ja) 2022-09-29
TW202244238A (zh) 2022-11-16

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231227