JPWO2022202844A1 - - Google Patents
Info
- Publication number
- JPWO2022202844A1 JPWO2022202844A1 JP2023509213A JP2023509213A JPWO2022202844A1 JP WO2022202844 A1 JPWO2022202844 A1 JP WO2022202844A1 JP 2023509213 A JP2023509213 A JP 2023509213A JP 2023509213 A JP2023509213 A JP 2023509213A JP WO2022202844 A1 JPWO2022202844 A1 JP WO2022202844A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021054376 | 2021-03-26 | ||
PCT/JP2022/013288 WO2022202844A1 (ja) | 2021-03-26 | 2022-03-22 | 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022202844A1 true JPWO2022202844A1 (zh) | 2022-09-29 |
Family
ID=83395626
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023509214A Pending JPWO2022202845A1 (zh) | 2021-03-26 | 2022-03-22 | |
JP2023509213A Pending JPWO2022202844A1 (zh) | 2021-03-26 | 2022-03-22 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023509214A Pending JPWO2022202845A1 (zh) | 2021-03-26 | 2022-03-22 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JPWO2022202845A1 (zh) |
TW (2) | TW202244238A (zh) |
WO (2) | WO2022202845A1 (zh) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY185987A (en) * | 2015-12-22 | 2021-06-14 | Lintec Corp | Curable composition, method for producing curable composition, cured product, use of curable composition, and optical device |
WO2018030287A1 (ja) * | 2016-08-08 | 2018-02-15 | 東レ・ダウコーニング株式会社 | 硬化性粒状シリコーン組成物、それからなる半導体用部材、およびその成型方法 |
TWI815979B (zh) * | 2018-09-28 | 2023-09-21 | 日商琳得科股份有限公司 | 硬化性組合物、硬化物及硬化性組合物的使用方法 |
-
2022
- 2022-03-17 TW TW111109818A patent/TW202244238A/zh unknown
- 2022-03-17 TW TW111109817A patent/TW202244237A/zh unknown
- 2022-03-22 WO PCT/JP2022/013289 patent/WO2022202845A1/ja active Application Filing
- 2022-03-22 JP JP2023509214A patent/JPWO2022202845A1/ja active Pending
- 2022-03-22 WO PCT/JP2022/013288 patent/WO2022202844A1/ja active Application Filing
- 2022-03-22 JP JP2023509213A patent/JPWO2022202844A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPWO2022202845A1 (zh) | 2022-09-29 |
TW202244237A (zh) | 2022-11-16 |
WO2022202844A1 (ja) | 2022-09-29 |
WO2022202845A1 (ja) | 2022-09-29 |
TW202244238A (zh) | 2022-11-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231227 |