JPWO2022201627A1 - - Google Patents

Info

Publication number
JPWO2022201627A1
JPWO2022201627A1 JP2022520071A JP2022520071A JPWO2022201627A1 JP WO2022201627 A1 JPWO2022201627 A1 JP WO2022201627A1 JP 2022520071 A JP2022520071 A JP 2022520071A JP 2022520071 A JP2022520071 A JP 2022520071A JP WO2022201627 A1 JPWO2022201627 A1 JP WO2022201627A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022520071A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201627A1 publication Critical patent/JPWO2022201627A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022520071A 2021-03-25 2021-11-15 Pending JPWO2022201627A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021051539 2021-03-25
PCT/JP2021/041871 WO2022201627A1 (ja) 2021-03-25 2021-11-15 接合体およびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022201627A1 true JPWO2022201627A1 (ja) 2022-09-29

Family

ID=83395282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022520071A Pending JPWO2022201627A1 (ja) 2021-03-25 2021-11-15

Country Status (6)

Country Link
US (1) US20230074173A1 (ja)
EP (1) EP4131777A4 (ja)
JP (1) JPWO2022201627A1 (ja)
KR (1) KR20220156894A (ja)
CN (1) CN116941182A (ja)
WO (1) WO2022201627A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2783550B2 (ja) * 1988-07-27 1998-08-06 富士通株式会社 弾性表面波発振素子
JPH04258008A (ja) * 1991-02-12 1992-09-14 Murata Mfg Co Ltd 弾性表面波装置の製造方法
US7105980B2 (en) 2002-07-03 2006-09-12 Sawtek, Inc. Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
DE102005055870A1 (de) * 2005-11-23 2007-05-24 Epcos Ag Elektroakustisches Bauelement
JP4289399B2 (ja) * 2006-06-22 2009-07-01 セイコーエプソン株式会社 弾性波デバイスおよび弾性波デバイスの製造方法
JP2010040877A (ja) * 2008-08-06 2010-02-18 Seiko Epson Corp 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置
JP6454606B2 (ja) 2015-06-02 2019-01-16 信越化学工業株式会社 酸化物単結晶薄膜を備えた複合ウェーハの製造方法
WO2018180827A1 (ja) * 2017-03-31 2018-10-04 日本碍子株式会社 接合体および弾性波素子
JP7069338B2 (ja) * 2018-10-17 2022-05-17 日本碍子株式会社 接合体および弾性波素子

Also Published As

Publication number Publication date
KR20220156894A (ko) 2022-11-28
WO2022201627A1 (ja) 2022-09-29
CN116941182A (zh) 2023-10-24
EP4131777A1 (en) 2023-02-08
US20230074173A1 (en) 2023-03-09
EP4131777A4 (en) 2023-11-22

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