JPWO2022191026A1 - - Google Patents
Info
- Publication number
- JPWO2022191026A1 JPWO2022191026A1 JP2023505479A JP2023505479A JPWO2022191026A1 JP WO2022191026 A1 JPWO2022191026 A1 JP WO2022191026A1 JP 2023505479 A JP2023505479 A JP 2023505479A JP 2023505479 A JP2023505479 A JP 2023505479A JP WO2022191026 A1 JPWO2022191026 A1 JP WO2022191026A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021037200 | 2021-03-09 | ||
JP2021037200 | 2021-03-09 | ||
PCT/JP2022/009116 WO2022191026A1 (ja) | 2021-03-09 | 2022-03-03 | レニウムタングステン線棒およびそれを用いた熱電対 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022191026A1 true JPWO2022191026A1 (ja) | 2022-09-15 |
JP7550300B2 JP7550300B2 (ja) | 2024-09-12 |
Family
ID=83227852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023505479A Active JP7550300B2 (ja) | 2021-03-09 | 2022-03-03 | レニウムタングステン線棒およびそれを用いた熱電対 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230413672A1 (ja) |
EP (1) | EP4306670A1 (ja) |
JP (1) | JP7550300B2 (ja) |
CN (1) | CN116964235A (ja) |
WO (1) | WO2022191026A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023178898A (ja) * | 2022-06-06 | 2023-12-18 | パナソニックIpマネジメント株式会社 | タングステン合金線及び金属製品 |
WO2024204650A1 (ja) * | 2023-03-31 | 2024-10-03 | 株式会社 東芝 | タングステン合金、構造体及びレニウム粉末 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3296035A (en) * | 1963-04-01 | 1967-01-03 | Engelhard Ind Inc | Thermocouple having tungstenrhenium alloy leg wires |
JPS58104150A (ja) * | 1981-12-17 | 1983-06-21 | Seiko Epson Corp | 試料高温装置 |
JP2002356732A (ja) | 2001-05-29 | 2002-12-13 | Toshiba Corp | レニウムタングステン線、プローブピンおよびそれを具備する検査装置 |
CN100426445C (zh) * | 2001-10-09 | 2008-10-15 | 株式会社东芝 | 钨丝、阴极加热器和防振灯灯丝 |
JP4256126B2 (ja) | 2002-08-09 | 2009-04-22 | 株式会社東芝 | タングステン−レニウム材およびその製造方法、ならびにこのタングステン−レニウム材からなるブラウン管用カソードヒーター、管球フィラメントおよび電気特性検査用プローブピン |
JP5485259B2 (ja) | 2009-03-02 | 2014-05-07 | 株式会社東芝 | レニウムタングステン線、その製造方法およびそれを用いた医療用針 |
CN102586663B (zh) | 2012-04-05 | 2016-08-10 | 重庆材料研究院 | 一种W3Re-W25Re热电偶材料及其制备热电偶的方法 |
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2022
- 2022-03-03 JP JP2023505479A patent/JP7550300B2/ja active Active
- 2022-03-03 CN CN202280020091.8A patent/CN116964235A/zh active Pending
- 2022-03-03 WO PCT/JP2022/009116 patent/WO2022191026A1/ja active Application Filing
- 2022-03-03 EP EP22766984.3A patent/EP4306670A1/en active Pending
-
2023
- 2023-09-06 US US18/461,864 patent/US20230413672A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20230413672A1 (en) | 2023-12-21 |
JP7550300B2 (ja) | 2024-09-12 |
WO2022191026A1 (ja) | 2022-09-15 |
CN116964235A (zh) | 2023-10-27 |
EP4306670A1 (en) | 2024-01-17 |
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