JPWO2022186254A1 - - Google Patents
Info
- Publication number
- JPWO2022186254A1 JPWO2022186254A1 JP2023503894A JP2023503894A JPWO2022186254A1 JP WO2022186254 A1 JPWO2022186254 A1 JP WO2022186254A1 JP 2023503894 A JP2023503894 A JP 2023503894A JP 2023503894 A JP2023503894 A JP 2023503894A JP WO2022186254 A1 JPWO2022186254 A1 JP WO2022186254A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021032898 | 2021-03-02 | ||
| PCT/JP2022/008780 WO2022186254A1 (ja) | 2021-03-02 | 2022-03-02 | リソグラフィー用膜形成材料、組成物、リソグラフィー用下層膜、及びパターン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022186254A1 true JPWO2022186254A1 (ja) | 2022-09-09 |
Family
ID=83154602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023503894A Pending JPWO2022186254A1 (ja) | 2021-03-02 | 2022-03-02 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2022186254A1 (ja) |
| KR (1) | KR20230152680A (ja) |
| CN (1) | CN116964528A (ja) |
| TW (1) | TW202302522A (ja) |
| WO (1) | WO2022186254A1 (ja) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1312331B1 (it) * | 1999-05-27 | 2002-04-15 | Enichem Spa | Procedimento per la produzione di diamminodifenilmetano e suoiomologhi superiori. |
| JP3774668B2 (ja) | 2001-02-07 | 2006-05-17 | 東京エレクトロン株式会社 | シリコン窒化膜形成装置の洗浄前処理方法 |
| JP3914493B2 (ja) | 2002-11-27 | 2007-05-16 | 東京応化工業株式会社 | 多層レジストプロセス用下層膜形成材料およびこれを用いた配線形成方法 |
| KR100771800B1 (ko) | 2003-01-24 | 2007-10-30 | 도쿄 엘렉트론 가부시키가이샤 | 피처리 기판 상에 실리콘 질화막을 형성하는 ｃｖｄ 방법 |
| JP3981030B2 (ja) | 2003-03-07 | 2007-09-26 | 信越化学工業株式会社 | レジスト下層膜材料ならびにパターン形成方法 |
| JP4388429B2 (ja) | 2004-02-04 | 2009-12-24 | 信越化学工業株式会社 | レジスト下層膜材料ならびにパターン形成方法 |
| JP4781280B2 (ja) | 2006-01-25 | 2011-09-28 | 信越化学工業株式会社 | 反射防止膜材料、基板、及びパターン形成方法 |
| JP4638380B2 (ja) | 2006-01-27 | 2011-02-23 | 信越化学工業株式会社 | 反射防止膜材料、反射防止膜を有する基板及びパターン形成方法 |
| CN101889247B (zh) | 2007-12-07 | 2013-04-03 | 三菱瓦斯化学株式会社 | 用于形成光刻用下层膜的组合物和多层抗蚀图案的形成方法 |
| KR101741285B1 (ko) | 2009-09-15 | 2017-06-15 | 미츠비시 가스 가가쿠 가부시키가이샤 | 방향족 탄화수소 수지 및 리소그래피용 하층막 형성 조성물 |
| KR20210093903A (ko) * | 2018-11-21 | 2021-07-28 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 리소그래피용 막형성재료, 리소그래피용 막형성용 조성물, 리소그래피용 하층막 및 패턴형성방법 |
| US20220019146A1 (en) * | 2018-11-21 | 2022-01-20 | Mitsubishi Gas Chemical Company, Inc. | Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern |
| JPWO2022034831A1 (ja) * | 2020-08-14 | 2022-02-17 |
-
2022
- 2022-03-02 TW TW111107574A patent/TW202302522A/zh unknown
- 2022-03-02 KR KR1020237029426A patent/KR20230152680A/ko unknown
- 2022-03-02 JP JP2023503894A patent/JPWO2022186254A1/ja active Pending
- 2022-03-02 WO PCT/JP2022/008780 patent/WO2022186254A1/ja active Application Filing
- 2022-03-02 CN CN202280018243.0A patent/CN116964528A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN116964528A (zh) | 2023-10-27 |
| WO2022186254A1 (ja) | 2022-09-09 |
| KR20230152680A (ko) | 2023-11-03 |
| TW202302522A (zh) | 2023-01-16 |