JPWO2022176188A1 - - Google Patents

Info

Publication number
JPWO2022176188A1
JPWO2022176188A1 JP2023500482A JP2023500482A JPWO2022176188A1 JP WO2022176188 A1 JPWO2022176188 A1 JP WO2022176188A1 JP 2023500482 A JP2023500482 A JP 2023500482A JP 2023500482 A JP2023500482 A JP 2023500482A JP WO2022176188 A1 JPWO2022176188 A1 JP WO2022176188A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023500482A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022176188A1 publication Critical patent/JPWO2022176188A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/714—Electrodes having non-planar surfaces, e.g. formed by texturisation having horizontal extensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2023500482A 2021-02-22 2021-02-22 Pending JPWO2022176188A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/006570 WO2022176188A1 (ja) 2021-02-22 2021-02-22 キャパシタ

Publications (1)

Publication Number Publication Date
JPWO2022176188A1 true JPWO2022176188A1 (https=) 2022-08-25

Family

ID=82930447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023500482A Pending JPWO2022176188A1 (https=) 2021-02-22 2021-02-22

Country Status (3)

Country Link
US (1) US20240130046A1 (https=)
JP (1) JPWO2022176188A1 (https=)
WO (1) WO2022176188A1 (https=)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11501159A (ja) * 1995-03-03 1999-01-26 ノーザン・テレコム・リミテッド 集積回路用コンデンサ構造およびその製造方法
JP2001127247A (ja) * 1999-10-27 2001-05-11 Mitsubishi Electric Corp 半導体装置
JP2003536271A (ja) * 2000-06-19 2003-12-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ディープ・サブミクロンｃｍｏｓ用の積層ピラーアレイコンデンサ構造体
JP2005183739A (ja) * 2003-12-19 2005-07-07 Ricoh Co Ltd 容量素子
JP2006108455A (ja) * 2004-10-06 2006-04-20 Sony Corp 容量素子及び同容量素子を有する半導体装置
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
US20110108950A1 (en) * 2009-11-10 2011-05-12 Taiwan Semiconductor Manufacturing Company, Ltd. Vertical metal insulator metal capacitor
JP2015046549A (ja) * 2013-08-29 2015-03-12 三菱電機株式会社 半導体装置
JP2015154058A (ja) * 2014-02-19 2015-08-24 株式会社ソシオネクスト キャパシタアレイおよびａｄ変換器
WO2019087699A1 (ja) * 2017-11-02 2019-05-09 ローム株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7990676B2 (en) * 2007-10-10 2011-08-02 Advanced Micro Devices, Inc. Density-conforming vertical plate capacitors exhibiting enhanced capacitance and methods of fabricating the same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11501159A (ja) * 1995-03-03 1999-01-26 ノーザン・テレコム・リミテッド 集積回路用コンデンサ構造およびその製造方法
JP2001127247A (ja) * 1999-10-27 2001-05-11 Mitsubishi Electric Corp 半導体装置
JP2003536271A (ja) * 2000-06-19 2003-12-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ディープ・サブミクロンｃｍｏｓ用の積層ピラーアレイコンデンサ構造体
JP2005183739A (ja) * 2003-12-19 2005-07-07 Ricoh Co Ltd 容量素子
JP2006108455A (ja) * 2004-10-06 2006-04-20 Sony Corp 容量素子及び同容量素子を有する半導体装置
JP2006261455A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 半導体装置およびｍｉｍキャパシタ
US20110108950A1 (en) * 2009-11-10 2011-05-12 Taiwan Semiconductor Manufacturing Company, Ltd. Vertical metal insulator metal capacitor
JP2015046549A (ja) * 2013-08-29 2015-03-12 三菱電機株式会社 半導体装置
JP2015154058A (ja) * 2014-02-19 2015-08-24 株式会社ソシオネクスト キャパシタアレイおよびａｄ変換器
WO2019087699A1 (ja) * 2017-11-02 2019-05-09 ローム株式会社 半導体装置

Also Published As

Publication number Publication date
WO2022176188A1 (ja) 2022-08-25
US20240130046A1 (en) 2024-04-18

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112021017747A2 (https=)
BR112023011738A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR112023016292A2 (https=)
BR112023011610A2 (https=)
BR112023011539A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021015450A8 (https=)
BR102021015247A2 (https=)
BR102021015220A2 (https=)
BR102021014044A2 (https=)
BR102021014056A2 (https=)
BR102021013929A2 (https=)
BR102021012571A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230607

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240611

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240809

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20240827