JPWO2022173005A1 - - Google Patents

Info

Publication number
JPWO2022173005A1
JPWO2022173005A1 JP2022580686A JP2022580686A JPWO2022173005A1 JP WO2022173005 A1 JPWO2022173005 A1 JP WO2022173005A1 JP 2022580686 A JP2022580686 A JP 2022580686A JP 2022580686 A JP2022580686 A JP 2022580686A JP WO2022173005 A1 JPWO2022173005 A1 JP WO2022173005A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022580686A
Other versions
JP7414162B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022173005A1 publication Critical patent/JPWO2022173005A1/ja
Application granted granted Critical
Publication of JP7414162B2 publication Critical patent/JP7414162B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Devices (AREA)
JP2022580686A 2021-02-12 2022-02-10 発光素子パッケージ及びその製造方法 Active JP7414162B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021021309 2021-02-12
JP2021021309 2021-02-12
PCT/JP2022/005402 WO2022173005A1 (ja) 2021-02-12 2022-02-10 発光素子パッケージ及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022173005A1 true JPWO2022173005A1 (ja) 2022-08-18
JP7414162B2 JP7414162B2 (ja) 2024-01-16

Family

ID=82838346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580686A Active JP7414162B2 (ja) 2021-02-12 2022-02-10 発光素子パッケージ及びその製造方法

Country Status (3)

Country Link
JP (1) JP7414162B2 (ja)
TW (1) TW202249126A (ja)
WO (1) WO2022173005A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018135494A (ja) * 2017-02-24 2018-08-30 信越化学工業株式会社 光半導体用熱硬化性エポキシ樹脂組成物及び半導体装置
JP2020088381A (ja) * 2018-11-15 2020-06-04 日亜化学工業株式会社 発光装置の製造方法
JP2020535635A (ja) * 2017-09-29 2020-12-03 ソウル セミコンダクター カンパニー リミテッドＳｅｏｕｌ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｃｏ．， Ｌｔｄ． 発光素子及びそれを有する表示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013202910A1 (de) * 2013-02-22 2014-09-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6217711B2 (ja) * 2015-08-21 2017-10-25 日亜化学工業株式会社 発光装置の製造方法
JP6566016B2 (ja) * 2016-12-21 2019-08-28 日亜化学工業株式会社 発光装置の製造方法
JP6888296B2 (ja) 2016-12-26 2021-06-16 日亜化学工業株式会社 発光装置の製造方法
CN108682729A (zh) * 2018-05-04 2018-10-19 惠州市华瑞光源科技有限公司 Csp led的封装方法及csp led的封装结构
KR20200019514A (ko) * 2018-08-14 2020-02-24 서울반도체 주식회사 발광 다이오드 패키지 및 발광 다이오드 패키지를 포함하는 디스플레이 장치
JP7284373B2 (ja) * 2018-12-28 2023-05-31 日亜化学工業株式会社 発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018135494A (ja) * 2017-02-24 2018-08-30 信越化学工業株式会社 光半導体用熱硬化性エポキシ樹脂組成物及び半導体装置
JP2020535635A (ja) * 2017-09-29 2020-12-03 ソウル セミコンダクター カンパニー リミテッドＳｅｏｕｌ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｃｏ．， Ｌｔｄ． 発光素子及びそれを有する表示装置
JP2020088381A (ja) * 2018-11-15 2020-06-04 日亜化学工業株式会社 発光装置の製造方法

Also Published As

Publication number Publication date
JP7414162B2 (ja) 2024-01-16
TW202249126A (zh) 2022-12-16
WO2022173005A1 (ja) 2022-08-18

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