JPWO2022168694A1 - - Google Patents

Info

Publication number
JPWO2022168694A1
JPWO2022168694A1 JP2022530810A JP2022530810A JPWO2022168694A1 JP WO2022168694 A1 JPWO2022168694 A1 JP WO2022168694A1 JP 2022530810 A JP2022530810 A JP 2022530810A JP 2022530810 A JP2022530810 A JP 2022530810A JP WO2022168694 A1 JPWO2022168694 A1 JP WO2022168694A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022530810A
Other languages
Japanese (ja)
Other versions
JP7151940B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022168694A1 publication Critical patent/JPWO2022168694A1/ja
Application granted granted Critical
Publication of JP7151940B1 publication Critical patent/JP7151940B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022530810A 2021-02-03 2022-01-26 封止用樹脂組成物および半導体装置 Active JP7151940B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021015658 2021-02-03
JP2021015658 2021-02-03
PCT/JP2022/002834 WO2022168694A1 (ja) 2021-02-03 2022-01-26 封止用樹脂組成物および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022168694A1 true JPWO2022168694A1 (zh) 2022-08-11
JP7151940B1 JP7151940B1 (ja) 2022-10-12

Family

ID=82741617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022530810A Active JP7151940B1 (ja) 2021-02-03 2022-01-26 封止用樹脂組成物および半導体装置

Country Status (3)

Country Link
JP (1) JP7151940B1 (zh)
CN (1) CN116745903B (zh)
WO (1) WO2022168694A1 (zh)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5359263B2 (ja) * 2008-12-26 2013-12-04 東洋紡株式会社 電気電子部品封止用樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体
JP6388228B2 (ja) * 2013-12-27 2018-09-12 パナソニックＩｐマネジメント株式会社 半導体封止用液状エポキシ樹脂組成物とそれを用いた半導体装置
JP2017101140A (ja) * 2015-12-01 2017-06-08 三菱化学株式会社 樹脂組成物および該樹脂組成物からなる層を有する半導体装置
JP7091618B2 (ja) * 2016-09-27 2022-06-28 住友ベークライト株式会社 静電容量型センサ封止用樹脂組成物および静電容量型センサ
KR102411863B1 (ko) * 2017-03-01 2022-06-22 도요보 가부시키가이샤 푸란디카르복실산 유닛을 갖는 폴리에스테르 필름과 히트 시일성 수지층을 구비하는 적층체 및 포장 주머니
KR102387943B1 (ko) * 2017-05-17 2022-04-18 린텍 가부시키가이샤 반도체 장치 및 이의 제조 방법
JP7127251B2 (ja) * 2017-06-05 2022-08-30 住友ベークライト株式会社 封止用樹脂組成物および構造体
JP7007827B2 (ja) * 2017-07-28 2022-01-25 日東電工株式会社 ダイボンドフィルム、ダイシングダイボンドフィルム、および半導体装置製造方法
WO2019082963A1 (ja) * 2017-10-27 2019-05-02 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
JP7225553B2 (ja) * 2018-03-30 2023-02-21 住友ベークライト株式会社 ソルダーレジスト形成用の樹脂シート
JP2020152825A (ja) * 2019-03-20 2020-09-24 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2020193293A (ja) * 2019-05-29 2020-12-03 昭和電工マテリアルズ株式会社 封止用樹脂組成物、硬化物、及び電子部品装置
JP7333211B2 (ja) * 2019-06-21 2023-08-24 リンテック株式会社 保護膜形成用複合シート、及び保護膜付き半導体チップの製造方法

Also Published As

Publication number Publication date
CN116745903B (zh) 2024-02-02
JP7151940B1 (ja) 2022-10-12
WO2022168694A1 (ja) 2022-08-11
CN116745903A (zh) 2023-09-12

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