JPWO2022168188A1 - - Google Patents

Info

Publication number
JPWO2022168188A1
JPWO2022168188A1 JP2021565782A JP2021565782A JPWO2022168188A1 JP WO2022168188 A1 JPWO2022168188 A1 JP WO2022168188A1 JP 2021565782 A JP2021565782 A JP 2021565782A JP 2021565782 A JP2021565782 A JP 2021565782A JP WO2022168188 A1 JPWO2022168188 A1 JP WO2022168188A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021565782A
Other languages
Japanese (ja)
Other versions
JP7023436B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7023436B1 publication Critical patent/JP7023436B1/ja
Publication of JPWO2022168188A1 publication Critical patent/JPWO2022168188A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629Square array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00Piezoelectric transducers; Electrostrictive transducers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00Monitoring arrangements; Testing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/03Assembling devices that include piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2021565782A 2021-02-03 2021-02-03 超音波トランスデューサー及びその製造方法 Active JP7023436B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/003816 WO2022168188A1 (ja) 2021-02-03 2021-02-03 超音波トランスデューサー及びその製造方法

Publications (2)

Publication Number Publication Date
JP7023436B1 JP7023436B1 (ja) 2022-02-21
JPWO2022168188A1 true JPWO2022168188A1 (https=) 2022-08-11

Family

ID=81076728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565782A Active JP7023436B1 (ja) 2021-02-03 2021-02-03 超音波トランスデューサー及びその製造方法

Country Status (3)

Country Link
US (1) US20240082877A1 (https=)
JP (1) JP7023436B1 (https=)
WO (1) WO2022168188A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114864806B (zh) * 2022-06-01 2026-02-03 上海交通大学 具有短波导结构的超声换能器及制造方法、超声检测装置
CN114947946A (zh) * 2022-06-01 2022-08-30 上海交通大学 柔性超声换能器及其制造方法、超声检测装置
US20260097418A1 (en) * 2022-12-08 2026-04-09 Suncall Corporation Ultrasonic Transducer Array and Ultrasonic Phased Array Sensor
JP7671420B2 (ja) * 2023-03-27 2025-05-01 サンコール株式会社 圧電素子、超音波トランスデューサー及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7127554B2 (ja) * 2019-01-18 2022-08-30 コニカミノルタ株式会社 超音波プローブ、及び超音波診断装置
EP4424430A3 (en) * 2020-01-30 2024-11-13 Suncall Corporation Ultrasonic transducer and method for manufacturing the same

Also Published As

Publication number Publication date
JP7023436B1 (ja) 2022-02-21
US20240082877A1 (en) 2024-03-14
WO2022168188A1 (ja) 2022-08-11

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