JPWO2022163284A1 - - Google Patents

Info

Publication number
JPWO2022163284A1
JPWO2022163284A1 JP2022578192A JP2022578192A JPWO2022163284A1 JP WO2022163284 A1 JPWO2022163284 A1 JP WO2022163284A1 JP 2022578192 A JP2022578192 A JP 2022578192A JP 2022578192 A JP2022578192 A JP 2022578192A JP WO2022163284 A1 JPWO2022163284 A1 JP WO2022163284A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022578192A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022163284A1 publication Critical patent/JPWO2022163284A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022578192A 2021-01-29 2021-12-27 Pending JPWO2022163284A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021012623 2021-01-29
PCT/JP2021/048602 WO2022163284A1 (ja) 2021-01-29 2021-12-27 接着剤組成物

Publications (1)

Publication Number Publication Date
JPWO2022163284A1 true JPWO2022163284A1 (ja) 2022-08-04

Family

ID=82654579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022578192A Pending JPWO2022163284A1 (ja) 2021-01-29 2021-12-27

Country Status (2)

Country Link
JP (1) JPWO2022163284A1 (ja)
WO (1) WO2022163284A1 (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08259849A (ja) * 1995-03-24 1996-10-08 Daicel Chem Ind Ltd プライマー組成物、および難接着プラスチック素材の加工方法
WO2001068785A1 (fr) * 2000-03-13 2001-09-20 Sumitomo Chemical Company, Limited Adhesif, procede de production de stratifie avec l'adhesif, et stratifie
JP2004182916A (ja) * 2002-12-05 2004-07-02 Shinwako Kasei Kk 透湿性樹脂組成物及び透湿性伸縮フィルム
JP2007186649A (ja) * 2006-01-16 2007-07-26 Panac Co Ltd ヒートシール性自己粘着シート
JP5644989B2 (ja) * 2008-03-03 2014-12-24 独立行政法人産業技術総合研究所 スチレン系熱可塑性エラストマーの中空マイクロカプセルおよびその製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6578142B2 (ja) * 2014-06-26 2019-09-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
KR102287528B1 (ko) * 2014-07-31 2021-08-09 도아고세이가부시키가이샤 접착제층을 갖는 적층체, 및 이것을 사용한 플렉시블 동장 적층판 및 플렉시블 플랫 케이블
JP6759873B2 (ja) * 2015-09-03 2020-09-23 株式会社村田製作所 フレキシブル銅張積層板の製造方法とフレキシブル銅張積層板
JP6837907B2 (ja) * 2017-04-26 2021-03-03 アロン化成株式会社 熱可塑性エラストマー組成物
CN112789317B (zh) * 2018-10-02 2023-03-10 纳美仕有限公司 树脂组合物、带有基材的膜、金属/树脂层压体及半导体装置
JPWO2021131268A1 (ja) * 2019-12-23 2021-07-01

Also Published As

Publication number Publication date
WO2022163284A1 (ja) 2022-08-04

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Legal Events

Date Code Title Description
A621 Written request for application examination

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Effective date: 20240419