JPWO2022158357A1 - - Google Patents

Info

Publication number
JPWO2022158357A1
JPWO2022158357A1 JP2022576623A JP2022576623A JPWO2022158357A1 JP WO2022158357 A1 JPWO2022158357 A1 JP WO2022158357A1 JP 2022576623 A JP2022576623 A JP 2022576623A JP 2022576623 A JP2022576623 A JP 2022576623A JP WO2022158357 A1 JPWO2022158357 A1 JP WO2022158357A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022576623A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022158357A1 publication Critical patent/JPWO2022158357A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2022576623A 2021-01-21 2022-01-12 Pending JPWO2022158357A1 (enExample)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021008220 2021-01-21
PCT/JP2022/000781 WO2022158357A1 (ja) 2021-01-21 2022-01-12 マスター原盤及び金属成形物の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022158357A1 true JPWO2022158357A1 (enExample) 2022-07-28

Family

ID=82548937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022576623A Pending JPWO2022158357A1 (enExample) 2021-01-21 2022-01-12

Country Status (4)

Country Link
US (1) US20230357943A1 (enExample)
EP (1) EP4283022A4 (enExample)
JP (1) JPWO2022158357A1 (enExample)
WO (1) WO2022158357A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024071312A (ja) * 2022-11-14 2024-05-24 株式会社ヨコオ 電鋳バネの製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780795A (en) * 1980-11-07 1982-05-20 Fujitsu Ltd Method of producing printed board
JP2003072021A (ja) * 2001-09-03 2003-03-12 Process Lab Micron:Kk 印刷用メタルマスク
JP2005310807A (ja) * 2004-04-16 2005-11-04 Fujitsu Ltd 半導体装置及びその製造方法
WO2006068175A1 (ja) * 2004-12-24 2006-06-29 Hitachi Chemical Co., Ltd. 導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材
JP2010086579A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp 原盤及びそれから作製されたモールド構造体
JP2012517919A (ja) * 2009-02-18 2012-08-09 ロリク アーゲー 表面レリーフ微細構造、関連するデバイスおよびそれらを作製する方法
JP2015030881A (ja) * 2013-08-02 2015-02-16 株式会社オプトニクス精密 開口プレート
US20150352831A1 (en) * 2012-02-08 2015-12-10 Photo Stencil, Llc Screen Printing Apparatus Including Support Bars, And Methods Of Using Same
JP2016182709A (ja) * 2015-03-25 2016-10-20 株式会社ソノコム ダミーパターンを使用したサスペンドメタルマスクおよびダミーパターンを使用したサスペンドメタルマスクの製造方法
US20200208284A1 (en) * 2018-12-31 2020-07-02 Lg Display Co., Ltd. Mask and method of manufacturing the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3200923B2 (ja) * 1992-03-02 2001-08-20 株式会社村田製作所 エレクトロフォーミング方法
JP7292132B2 (ja) 2019-07-02 2023-06-16 三菱電機株式会社 衛星制御装置、観測システム、観測方法、および観測プログラム

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5780795A (en) * 1980-11-07 1982-05-20 Fujitsu Ltd Method of producing printed board
JP2003072021A (ja) * 2001-09-03 2003-03-12 Process Lab Micron:Kk 印刷用メタルマスク
JP2005310807A (ja) * 2004-04-16 2005-11-04 Fujitsu Ltd 半導体装置及びその製造方法
WO2006068175A1 (ja) * 2004-12-24 2006-06-29 Hitachi Chemical Co., Ltd. 導体層パターン付き基材の製造法、導体層パターン付き基材及びそれを用いた電磁波遮蔽部材
JP2010086579A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp 原盤及びそれから作製されたモールド構造体
JP2012517919A (ja) * 2009-02-18 2012-08-09 ロリク アーゲー 表面レリーフ微細構造、関連するデバイスおよびそれらを作製する方法
US20150352831A1 (en) * 2012-02-08 2015-12-10 Photo Stencil, Llc Screen Printing Apparatus Including Support Bars, And Methods Of Using Same
JP2015030881A (ja) * 2013-08-02 2015-02-16 株式会社オプトニクス精密 開口プレート
JP2016182709A (ja) * 2015-03-25 2016-10-20 株式会社ソノコム ダミーパターンを使用したサスペンドメタルマスクおよびダミーパターンを使用したサスペンドメタルマスクの製造方法
US20200208284A1 (en) * 2018-12-31 2020-07-02 Lg Display Co., Ltd. Mask and method of manufacturing the same

Also Published As

Publication number Publication date
WO2022158357A1 (ja) 2022-07-28
EP4283022A4 (en) 2024-12-18
US20230357943A1 (en) 2023-11-09
EP4283022A1 (en) 2023-11-29

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