JPWO2022153891A1 - - Google Patents
Info
- Publication number
- JPWO2022153891A1 JPWO2022153891A1 JP2022535194A JP2022535194A JPWO2022153891A1 JP WO2022153891 A1 JPWO2022153891 A1 JP WO2022153891A1 JP 2022535194 A JP2022535194 A JP 2022535194A JP 2022535194 A JP2022535194 A JP 2022535194A JP WO2022153891 A1 JPWO2022153891 A1 JP WO2022153891A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022190059A JP7538845B2 (ja) | 2021-01-12 | 2022-11-29 | 積層体、及び、パワーモジュール |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021003040 | 2021-01-12 | ||
| JP2021003040 | 2021-01-12 | ||
| PCT/JP2022/000041 WO2022153891A1 (ja) | 2021-01-12 | 2022-01-04 | 積層体、及びその製造方法、並びに、パワーモジュール |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022190059A Division JP7538845B2 (ja) | 2021-01-12 | 2022-11-29 | 積層体、及び、パワーモジュール |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022153891A1 true JPWO2022153891A1 (https=) | 2022-07-21 |
| JP7186929B1 JP7186929B1 (ja) | 2022-12-09 |
| JPWO2022153891A5 JPWO2022153891A5 (https=) | 2022-12-19 |
Family
ID=82447341
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022535194A Active JP7186929B1 (ja) | 2021-01-12 | 2022-01-04 | 積層体、及びその製造方法、並びに、パワーモジュール |
| JP2022190059A Active JP7538845B2 (ja) | 2021-01-12 | 2022-11-29 | 積層体、及び、パワーモジュール |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022190059A Active JP7538845B2 (ja) | 2021-01-12 | 2022-11-29 | 積層体、及び、パワーモジュール |
Country Status (2)
| Country | Link |
|---|---|
| JP (2) | JP7186929B1 (https=) |
| WO (1) | WO2022153891A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3468358B2 (ja) * | 1998-11-12 | 2003-11-17 | 電気化学工業株式会社 | 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品 |
| JP5409740B2 (ja) * | 2011-09-28 | 2014-02-05 | 日本発條株式会社 | 放熱構造体、パワーモジュール、放熱構造体の製造方法およびパワーモジュールの製造方法 |
| US20180315680A1 (en) * | 2015-11-11 | 2018-11-01 | Nhk Spring Co., Ltd. | Laminate and method of manufacturing laminate |
| EP3572555B1 (en) * | 2017-01-17 | 2021-03-03 | Shinshu University | Method for manufacturing ceramic circuit board |
| WO2018135490A1 (ja) * | 2017-01-17 | 2018-07-26 | デンカ株式会社 | セラミックス回路基板の製造方法 |
| JP7027094B2 (ja) * | 2017-09-28 | 2022-03-01 | デンカ株式会社 | 放熱部品付きパワーモジュール |
-
2022
- 2022-01-04 JP JP2022535194A patent/JP7186929B1/ja active Active
- 2022-01-04 WO PCT/JP2022/000041 patent/WO2022153891A1/ja not_active Ceased
- 2022-11-29 JP JP2022190059A patent/JP7538845B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7538845B2 (ja) | 2024-08-22 |
| JP2023026431A (ja) | 2023-02-24 |
| JP7186929B1 (ja) | 2022-12-09 |
| WO2022153891A1 (ja) | 2022-07-21 |
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