JP7186929B1 - 積層体、及びその製造方法、並びに、パワーモジュール - Google Patents

積層体、及びその製造方法、並びに、パワーモジュール Download PDF

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Publication number
JP7186929B1
JP7186929B1 JP2022535194A JP2022535194A JP7186929B1 JP 7186929 B1 JP7186929 B1 JP 7186929B1 JP 2022535194 A JP2022535194 A JP 2022535194A JP 2022535194 A JP2022535194 A JP 2022535194A JP 7186929 B1 JP7186929 B1 JP 7186929B1
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Japan
Prior art keywords
layer
metal
ceramic plate
alloy
powder
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JP2022535194A
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Japanese (ja)
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JPWO2022153891A1 (https=
JPWO2022153891A5 (https=
Inventor
優也 弓場
篤士 酒井
賢久 上島
賢太郎 中山
佳孝 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2022153891A5 publication Critical patent/JPWO2022153891A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2022535194A 2021-01-12 2022-01-04 積層体、及びその製造方法、並びに、パワーモジュール Active JP7186929B1 (ja)

Priority Applications (1)

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JP2022190059A JP7538845B2 (ja) 2021-01-12 2022-11-29 積層体、及び、パワーモジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021003040 2021-01-12
JP2021003040 2021-01-12
PCT/JP2022/000041 WO2022153891A1 (ja) 2021-01-12 2022-01-04 積層体、及びその製造方法、並びに、パワーモジュール

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JP2022190059A Division JP7538845B2 (ja) 2021-01-12 2022-11-29 積層体、及び、パワーモジュール

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JPWO2022153891A1 JPWO2022153891A1 (https=) 2022-07-21
JP7186929B1 true JP7186929B1 (ja) 2022-12-09
JPWO2022153891A5 JPWO2022153891A5 (https=) 2022-12-19

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JP2022535194A Active JP7186929B1 (ja) 2021-01-12 2022-01-04 積層体、及びその製造方法、並びに、パワーモジュール
JP2022190059A Active JP7538845B2 (ja) 2021-01-12 2022-11-29 積層体、及び、パワーモジュール

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WO (1) WO2022153891A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281468A (ja) * 1998-11-12 2000-10-10 Denki Kagaku Kogyo Kk 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
JP2013074199A (ja) * 2011-09-28 2013-04-22 Nhk Spring Co Ltd 放熱構造体、パワーモジュール、放熱構造体の製造方法およびパワーモジュールの製造方法
WO2017082368A1 (ja) * 2015-11-11 2017-05-18 日本発條株式会社 積層体および積層体の製造方法
WO2018135490A1 (ja) * 2017-01-17 2018-07-26 デンカ株式会社 セラミックス回路基板の製造方法
WO2018135499A1 (ja) * 2017-01-17 2018-07-26 国立大学法人信州大学 セラミックス回路基板の製造方法
JP2019067801A (ja) * 2017-09-28 2019-04-25 デンカ株式会社 放熱部品付きパワーモジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000281468A (ja) * 1998-11-12 2000-10-10 Denki Kagaku Kogyo Kk 炭化珪素質複合体及びその製造方法とそれを用いた放熱部品
JP2013074199A (ja) * 2011-09-28 2013-04-22 Nhk Spring Co Ltd 放熱構造体、パワーモジュール、放熱構造体の製造方法およびパワーモジュールの製造方法
WO2017082368A1 (ja) * 2015-11-11 2017-05-18 日本発條株式会社 積層体および積層体の製造方法
WO2018135490A1 (ja) * 2017-01-17 2018-07-26 デンカ株式会社 セラミックス回路基板の製造方法
WO2018135499A1 (ja) * 2017-01-17 2018-07-26 国立大学法人信州大学 セラミックス回路基板の製造方法
JP2019067801A (ja) * 2017-09-28 2019-04-25 デンカ株式会社 放熱部品付きパワーモジュール

Also Published As

Publication number Publication date
JP7538845B2 (ja) 2024-08-22
JPWO2022153891A1 (https=) 2022-07-21
JP2023026431A (ja) 2023-02-24
WO2022153891A1 (ja) 2022-07-21

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