JPWO2022153890A1 - - Google Patents
Info
- Publication number
- JPWO2022153890A1 JPWO2022153890A1 JP2022575535A JP2022575535A JPWO2022153890A1 JP WO2022153890 A1 JPWO2022153890 A1 JP WO2022153890A1 JP 2022575535 A JP2022575535 A JP 2022575535A JP 2022575535 A JP2022575535 A JP 2022575535A JP WO2022153890 A1 JPWO2022153890 A1 JP WO2022153890A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021003543 | 2021-01-13 | ||
PCT/JP2022/000039 WO2022153890A1 (ja) | 2021-01-13 | 2022-01-04 | 導電性膜およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022153890A1 true JPWO2022153890A1 (ja) | 2022-07-21 |
Family
ID=82447344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022575535A Pending JPWO2022153890A1 (ja) | 2021-01-13 | 2022-01-04 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230352205A1 (ja) |
JP (1) | JPWO2022153890A1 (ja) |
CN (1) | CN116745864A (ja) |
WO (1) | WO2022153890A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023120069A1 (ja) * | 2021-12-23 | 2023-06-29 | 株式会社村田製作所 | 積層体、物品、および物品の製造方法 |
CN117241661B (zh) * | 2023-11-10 | 2024-03-15 | 北京科技大学 | 二维氧族元素端基MXene薄膜及其制备方法与类脑半导体器件 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3197832B1 (en) * | 2014-09-25 | 2022-06-22 | Drexel University | Physical forms of mxene materials exhibiting novel electrical and optical characteristics |
JP6460383B2 (ja) * | 2014-12-11 | 2019-01-30 | Dic株式会社 | 導電性積層体及びその製造方法 |
KR102200472B1 (ko) * | 2016-04-22 | 2021-01-08 | 한국과학기술연구원 | Emi 차폐용 2차원 금속 탄화물, 질화물 및 탄질화물 필름 및 복합체 |
US20180338396A1 (en) * | 2017-05-16 | 2018-11-22 | Murata Manufacturing Co., Ltd. | Electronic component having electromagnetic shielding and method for producing the same |
JP7053544B2 (ja) * | 2018-10-02 | 2022-04-12 | コリア・インスティテュート・オブ・サイエンス・アンド・テクノロジー | 飽和または不飽和炭化水素を含む官能基で表面改質された2次元マキシン(MXene)粒子及びその製造方法及び用途 |
WO2020136864A1 (ja) * | 2018-12-28 | 2020-07-02 | 株式会社アドマテックス | MXene粒子材料、スラリー、二次電池、透明電極、MXene粒子材料の製造方法 |
CN110698847A (zh) * | 2019-10-21 | 2020-01-17 | 西北工业大学 | 水性聚氨酯-MXene电磁屏蔽仿生纳米复合材料膜及制备方法 |
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2022
- 2022-01-04 CN CN202280009193.XA patent/CN116745864A/zh active Pending
- 2022-01-04 WO PCT/JP2022/000039 patent/WO2022153890A1/ja active Application Filing
- 2022-01-04 JP JP2022575535A patent/JPWO2022153890A1/ja active Pending
-
2023
- 2023-07-10 US US18/349,593 patent/US20230352205A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN116745864A (zh) | 2023-09-12 |
US20230352205A1 (en) | 2023-11-02 |
WO2022153890A1 (ja) | 2022-07-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230627 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240820 |
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