JPWO2022149434A1 - - Google Patents

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Publication number
JPWO2022149434A1
JPWO2022149434A1 JP2022538695A JP2022538695A JPWO2022149434A1 JP WO2022149434 A1 JPWO2022149434 A1 JP WO2022149434A1 JP 2022538695 A JP2022538695 A JP 2022538695A JP 2022538695 A JP2022538695 A JP 2022538695A JP WO2022149434 A1 JPWO2022149434 A1 JP WO2022149434A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022538695A
Other versions
JP7124249B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022149434A1 publication Critical patent/JPWO2022149434A1/ja
Application granted granted Critical
Publication of JP7124249B1 publication Critical patent/JP7124249B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022538695A 2021-01-06 2021-12-17 放熱シート及び放熱シートの製造方法 Active JP7124249B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021000880 2021-01-06
JP2021000880 2021-01-06
PCT/JP2021/046743 WO2022149434A1 (ja) 2021-01-06 2021-12-17 放熱シート及び放熱シートの製造方法

Publications (2)

Publication Number Publication Date
JPWO2022149434A1 true JPWO2022149434A1 (ja) 2022-07-14
JP7124249B1 JP7124249B1 (ja) 2022-08-23

Family

ID=82357695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538695A Active JP7124249B1 (ja) 2021-01-06 2021-12-17 放熱シート及び放熱シートの製造方法

Country Status (5)

Country Link
US (1) US20240043730A1 (ja)
EP (1) EP4254487A4 (ja)
JP (1) JP7124249B1 (ja)
CN (1) CN116745905A (ja)
WO (1) WO2022149434A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5340202B2 (ja) * 2010-02-23 2013-11-13 三菱電機株式会社 熱硬化性樹脂組成物、ｂステージ熱伝導性シート及びパワーモジュール
JP6815152B2 (ja) * 2016-09-30 2021-01-20 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体
US11459443B2 (en) * 2017-06-23 2022-10-04 Sekisui Chemical Co., Ltd. Resin material, method for producing resin material, and laminate
JP6866799B2 (ja) * 2017-08-01 2021-04-28 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シートおよび複合部材
JP7389014B2 (ja) * 2018-02-26 2023-11-29 デンカ株式会社 絶縁放熱シート
KR20200099912A (ko) * 2019-02-15 2020-08-25 삼성전자주식회사 방열 시트 및 이를 포함하는 전자 장치
JP7467980B2 (ja) * 2019-02-27 2024-04-16 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイスの製造方法

Also Published As

Publication number Publication date
EP4254487A1 (en) 2023-10-04
EP4254487A4 (en) 2024-06-19
JP7124249B1 (ja) 2022-08-23
CN116745905A (zh) 2023-09-12
US20240043730A1 (en) 2024-02-08
WO2022149434A1 (ja) 2022-07-14

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