JPWO2022138154A1 - - Google Patents

Info

Publication number
JPWO2022138154A1
JPWO2022138154A1 JP2022572099A JP2022572099A JPWO2022138154A1 JP WO2022138154 A1 JPWO2022138154 A1 JP WO2022138154A1 JP 2022572099 A JP2022572099 A JP 2022572099A JP 2022572099 A JP2022572099 A JP 2022572099A JP WO2022138154 A1 JPWO2022138154 A1 JP WO2022138154A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022572099A
Other versions
JPWO2022138154A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138154A1 publication Critical patent/JPWO2022138154A1/ja
Publication of JPWO2022138154A5 publication Critical patent/JPWO2022138154A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2022572099A 2020-12-25 2021-12-08 Pending JPWO2022138154A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020217703 2020-12-25
PCT/JP2021/045044 WO2022138154A1 (ja) 2020-12-25 2021-12-08 積層体の製造方法、回路配線の製造方法、転写フィルム

Publications (2)

Publication Number Publication Date
JPWO2022138154A1 true JPWO2022138154A1 (ja) 2022-06-30
JPWO2022138154A5 JPWO2022138154A5 (ja) 2023-09-15

Family

ID=82157690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022572099A Pending JPWO2022138154A1 (ja) 2020-12-25 2021-12-08

Country Status (3)

Country Link
JP (1) JPWO2022138154A1 (ja)
CN (1) CN116670593A (ja)
WO (1) WO2022138154A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009069589A (ja) * 2007-09-14 2009-04-02 Fujifilm Corp 画像形成方法
CN102378940A (zh) * 2009-03-30 2012-03-14 旭化成电子材料株式会社 感光性树脂组合物及其层压体
JP6789193B2 (ja) * 2017-08-09 2020-11-25 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7067045B2 (ja) * 2017-12-13 2022-05-16 昭和電工マテリアルズ株式会社 半導体用感光性樹脂組成物及び半導体装置の製造方法
KR102605003B1 (ko) * 2018-06-22 2023-11-22 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 레지스트 패턴의 형성 방법

Also Published As

Publication number Publication date
WO2022138154A1 (ja) 2022-06-30
CN116670593A (zh) 2023-08-29

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230620