JPWO2022130980A1 - - Google Patents

Info

Publication number
JPWO2022130980A1
JPWO2022130980A1 JP2022569841A JP2022569841A JPWO2022130980A1 JP WO2022130980 A1 JPWO2022130980 A1 JP WO2022130980A1 JP 2022569841 A JP2022569841 A JP 2022569841A JP 2022569841 A JP2022569841 A JP 2022569841A JP WO2022130980 A1 JPWO2022130980 A1 JP WO2022130980A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022569841A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022130980A1 publication Critical patent/JPWO2022130980A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2022569841A 2020-12-14 2021-12-01 Pending JPWO2022130980A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020206407 2020-12-14
PCT/JP2021/044082 WO2022130980A1 (ja) 2020-12-14 2021-12-01 電子装置およびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2022130980A1 true JPWO2022130980A1 (https=) 2022-06-23

Family

ID=82057577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022569841A Pending JPWO2022130980A1 (https=) 2020-12-14 2021-12-01

Country Status (2)

Country Link
JP (1) JPWO2022130980A1 (https=)
WO (1) WO2022130980A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168990A (ja) * 1985-01-22 1986-07-30 松下電器産業株式会社 プリント回路基板
JPS62193780U (https=) * 1986-05-30 1987-12-09
JPH0575218A (ja) * 1991-06-19 1993-03-26 Hitachi Ltd 成形基板
JP2006295038A (ja) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd 立体構成電子回路ユニットの製造方法
JP2009302343A (ja) * 2008-06-13 2009-12-24 Denso Corp 多層基板及びその製造方法
JP2011108922A (ja) * 2009-11-19 2011-06-02 Murata Mfg Co Ltd 回路基板
JP2014160776A (ja) * 2013-02-20 2014-09-04 Murata Mfg Co Ltd 回路基板およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61168990A (ja) * 1985-01-22 1986-07-30 松下電器産業株式会社 プリント回路基板
JPS62193780U (https=) * 1986-05-30 1987-12-09
JPH0575218A (ja) * 1991-06-19 1993-03-26 Hitachi Ltd 成形基板
JP2006295038A (ja) * 2005-04-14 2006-10-26 Matsushita Electric Ind Co Ltd 立体構成電子回路ユニットの製造方法
JP2009302343A (ja) * 2008-06-13 2009-12-24 Denso Corp 多層基板及びその製造方法
JP2011108922A (ja) * 2009-11-19 2011-06-02 Murata Mfg Co Ltd 回路基板
JP2014160776A (ja) * 2013-02-20 2014-09-04 Murata Mfg Co Ltd 回路基板およびその製造方法

Also Published As

Publication number Publication date
WO2022130980A1 (ja) 2022-06-23

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