JPWO2022123633A1 - - Google Patents

Info

Publication number
JPWO2022123633A1
JPWO2022123633A1 JP2022567907A JP2022567907A JPWO2022123633A1 JP WO2022123633 A1 JPWO2022123633 A1 JP WO2022123633A1 JP 2022567907 A JP2022567907 A JP 2022567907A JP 2022567907 A JP2022567907 A JP 2022567907A JP WO2022123633 A1 JPWO2022123633 A1 JP WO2022123633A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2022567907A
Other languages
Japanese (ja)
Other versions
JPWO2022123633A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022123633A1 publication Critical patent/JPWO2022123633A1/ja
Publication of JPWO2022123633A5 publication Critical patent/JPWO2022123633A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/12Static random access memory [SRAM] devices comprising a MOSFET load element
    • H10B10/125Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/12Static random access memory [SRAM] devices comprising a MOSFET load element
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/025Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/63Vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6735Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes having gates fully surrounding the channels, e.g. gate-all-around
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6728Vertical TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10Integrated device layouts
JP2022567907A 2020-12-07 2020-12-07 Ceased JPWO2022123633A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/045497 WO2022123633A1 (ja) 2020-12-07 2020-12-07 柱状半導体メモリ装置とその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022123633A1 true JPWO2022123633A1 (https=) 2022-06-16
JPWO2022123633A5 JPWO2022123633A5 (https=) 2023-08-23

Family

ID=81973304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022567907A Ceased JPWO2022123633A1 (https=) 2020-12-07 2020-12-07

Country Status (4)

Country Link
US (1) US20230337410A1 (https=)
JP (1) JPWO2022123633A1 (https=)
TW (1) TWI815229B (https=)
WO (1) WO2022123633A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188281A (ja) * 2001-12-17 2003-07-04 Toshiba Corp 半導体装置及びその製造方法
JP2007317742A (ja) * 2006-05-23 2007-12-06 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
WO2009128337A1 (ja) * 2008-04-16 2009-10-22 日本電気株式会社 半導体装置およびその製造方法
WO2020202554A1 (ja) * 2019-04-05 2020-10-08 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 柱状半導体装置と、その製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102535448B1 (ko) * 2018-12-21 2023-05-26 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 3 차원 반도체 장치의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003188281A (ja) * 2001-12-17 2003-07-04 Toshiba Corp 半導体装置及びその製造方法
JP2007317742A (ja) * 2006-05-23 2007-12-06 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
WO2009128337A1 (ja) * 2008-04-16 2009-10-22 日本電気株式会社 半導体装置およびその製造方法
WO2020202554A1 (ja) * 2019-04-05 2020-10-08 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 柱状半導体装置と、その製造方法

Also Published As

Publication number Publication date
TWI815229B (zh) 2023-09-11
US20230337410A1 (en) 2023-10-19
TW202230751A (zh) 2022-08-01
WO2022123633A1 (ja) 2022-06-16

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