JPWO2022118749A5 - - Google Patents
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- Publication number
- JPWO2022118749A5 JPWO2022118749A5 JP2022549774A JP2022549774A JPWO2022118749A5 JP WO2022118749 A5 JPWO2022118749 A5 JP WO2022118749A5 JP 2022549774 A JP2022549774 A JP 2022549774A JP 2022549774 A JP2022549774 A JP 2022549774A JP WO2022118749 A5 JPWO2022118749 A5 JP WO2022118749A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- composition according
- encapsulating resin
- pressure
- encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 claims 15
- 238000007789 sealing Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000005538 encapsulation Methods 0.000 claims 2
- PKWIYNIDEDLDCJ-UHFFFAOYSA-N guanazole Chemical compound NC1=NNC(N)=N1 PKWIYNIDEDLDCJ-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000001721 transfer moulding Methods 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 238000000748 compression moulding Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000000155 melt Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000011144 upstream manufacturing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023091529A JP2023116574A (ja) | 2020-12-03 | 2023-06-02 | 封止用樹脂組成物および半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020200901 | 2020-12-03 | ||
| PCT/JP2021/043352 WO2022118749A1 (ja) | 2020-12-03 | 2021-11-26 | 封止用樹脂組成物および半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023091529A Division JP2023116574A (ja) | 2020-12-03 | 2023-06-02 | 封止用樹脂組成物および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118749A1 JPWO2022118749A1 (id) | 2022-06-09 |
| JPWO2022118749A5 true JPWO2022118749A5 (id) | 2022-11-16 |
Family
ID=81853884
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022549774A Pending JPWO2022118749A1 (id) | 2020-12-03 | 2021-11-26 | |
| JP2023091529A Pending JP2023116574A (ja) | 2020-12-03 | 2023-06-02 | 封止用樹脂組成物および半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023091529A Pending JP2023116574A (ja) | 2020-12-03 | 2023-06-02 | 封止用樹脂組成物および半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPWO2022118749A1 (id) |
| KR (1) | KR20230112671A (id) |
| CN (1) | CN116670821A (id) |
| TW (1) | TW202231767A (id) |
| WO (1) | WO2022118749A1 (id) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6225118A (ja) | 1985-07-25 | 1987-02-03 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JP5250801B2 (ja) * | 2008-09-11 | 2013-07-31 | 日東電工株式会社 | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
| CN102459397B (zh) * | 2009-06-22 | 2014-05-07 | 住友电木株式会社 | 半导体密封用树脂组合物、以及半导体装置 |
| CN102575085A (zh) * | 2009-10-20 | 2012-07-11 | 住友电木株式会社 | 半导体封装用环氧树脂组合物、半导体装置及脱模剂 |
| US20120280425A1 (en) * | 2009-11-24 | 2012-11-08 | Sumitomo Bakelite Co., Ltd. | Mold for measuring flow characteristics, method for measuring flow characteristics, resin composition for encapsulating semiconductor, and method for manufacturing semiconductor apparatus |
| JP5301597B2 (ja) * | 2011-03-14 | 2013-09-25 | 株式会社日本触媒 | 硬化性樹脂組成物およびこれを用いた半導体装置 |
| JP6227954B2 (ja) | 2013-09-26 | 2017-11-08 | 株式会社日本触媒 | 硬化性樹脂組成物及びその用途 |
| JP6794626B2 (ja) * | 2015-12-14 | 2020-12-02 | 住友ベークライト株式会社 | 封止用樹脂組成物、半導体装置および車載用電子制御ユニット |
| WO2019131379A1 (ja) * | 2017-12-25 | 2019-07-04 | 住友ベークライト株式会社 | 電子装置の製造方法 |
| CN110437764B (zh) * | 2019-08-16 | 2021-06-29 | 石家庄正旭环保建材有限公司 | 一种树脂改性淀粉粘合剂及其制备方法 |
-
2021
- 2021-11-26 JP JP2022549774A patent/JPWO2022118749A1/ja active Pending
- 2021-11-26 KR KR1020237020916A patent/KR20230112671A/ko unknown
- 2021-11-26 CN CN202180081746.8A patent/CN116670821A/zh active Pending
- 2021-11-26 WO PCT/JP2021/043352 patent/WO2022118749A1/ja active Application Filing
- 2021-12-01 TW TW110144835A patent/TW202231767A/zh unknown
-
2023
- 2023-06-02 JP JP2023091529A patent/JP2023116574A/ja active Pending
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