TW200610634A - Resin sealing mold - Google Patents
Resin sealing moldInfo
- Publication number
- TW200610634A TW200610634A TW094125572A TW94125572A TW200610634A TW 200610634 A TW200610634 A TW 200610634A TW 094125572 A TW094125572 A TW 094125572A TW 94125572 A TW94125572 A TW 94125572A TW 200610634 A TW200610634 A TW 200610634A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- resin
- pressure
- chip
- cope
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
To prevent the indentation of a substrate, damage such as a crack, or defectives such as the disconnection of a wiring pattern which the substrate bears when resin-sealing a chip attached to a thin substrate or a fragile substrate. A drag and a cope are provided to face each other. A substrate is placed on the mold surface of the drag, and a chip is attached to the chip attaching surface of the substrate. On the mold surface, a pressure absorbing layer of engineering plastic is formed to contain the substrate if viewed from above. The pressure absorbing layer has such heat resistance as enduring a temperature at the curing of a fluent resin, and a constant thickness, hardness, elasticity, and compression resistance. When the chip is resin-sealed, a fluent resin is injected in the cavity of the cope while the drag and the cope are clamped. Since the pressure absorbing layer locally deforms, pressure applied to the substrate, in other words, clamp pressure by mold-clamping and resin pressure from the fluent resin is reduced.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004244802A JP2006066486A (en) | 2004-08-25 | 2004-08-25 | Resin sealing mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200610634A true TW200610634A (en) | 2006-04-01 |
Family
ID=36112720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094125572A TW200610634A (en) | 2004-08-25 | 2005-07-28 | Resin sealing mold |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2006066486A (en) |
| KR (1) | KR100646905B1 (en) |
| TW (1) | TW200610634A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494974A (en) * | 2017-04-19 | 2019-11-22 | 立山科学工业股份有限公司 | Electronic module and its manufacturing method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100726724B1 (en) * | 2006-02-09 | 2007-06-11 | 한국생산기술연구원 | Multi-layer mold structure for hot embossing |
| WO2011105640A1 (en) * | 2010-02-25 | 2011-09-01 | 한미반도체 주식회사 | Compression molding device and method |
| WO2011105639A1 (en) * | 2010-02-25 | 2011-09-01 | 한미반도체 주식회사 | Compression molding device and method |
-
2004
- 2004-08-25 JP JP2004244802A patent/JP2006066486A/en active Pending
-
2005
- 2005-07-28 TW TW094125572A patent/TW200610634A/en unknown
- 2005-08-09 KR KR1020050072580A patent/KR100646905B1/en active IP Right Grant
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494974A (en) * | 2017-04-19 | 2019-11-22 | 立山科学工业股份有限公司 | Electronic module and its manufacturing method |
| CN110494974B (en) * | 2017-04-19 | 2023-02-28 | 立山科学工业股份有限公司 | Electronic module and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100646905B1 (en) | 2006-11-23 |
| JP2006066486A (en) | 2006-03-09 |
| KR20060050312A (en) | 2006-05-19 |
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