JPWO2022113369A5

JPWO2022113369A5 -

Info

Publication number: JPWO2022113369A5
Application number: JP2022565021A
Authority: JP
Filing date: 2020-11-30
Publication date: 2023-09-11

Description

【０００３】
対象の傾斜角度を取得する場合と異なり、検査対象の反射率の変化によらず、検査対象の傾斜角度を精度よく取得することができる。その結果、傾斜角度に基づく検査対象の状態の検査を精度よく行うことができる。
［０００９］
上記第１の局面による実装基板検査装置では、検査対象の反射率の変化によらないＲＧＢ比率に基づいて、検査対象の傾斜角度をより精度よく取得することができるので、傾斜角度に基づく検査対象の状態の検査をより精度よく行うことができる。
［００１０］
この場合、好ましくは、制御部は、検査対象のＲＧＢ比率と、予め取得したＲＧＢ比率を傾斜角度に換算する換算情報とに基づいて、検査対象の傾斜角度を取得するように構成されている。このように構成すれば、ＲＧＢ比率を傾斜角度に換算する換算情報により検査対象のＲＧＢ比率を傾斜角度に換算するだけで、検査対象の傾斜角度を簡単かつ確実に取得することができる。
［００１１］
上記第１の局面による実装基板検査装置において、好ましくは、同心円照明部は、同心円状に配置された赤色光源、緑色光源および青色光源を含むか、または、白色光源と、白色光源と対向する位置に配置されたＲＧＢの同心円カラーフィルタとを含む。このように構成すれば、同心円照明部が同心円状に配置された赤色光源、緑色光源および青色光源を含む場合、赤色、緑色および青色が同心円状に配置されたＲＧＢの同心円光を容易に得ることができる。また、白色光源と、白色光源と対向する位置に配置されたＲＧＢの同心円カラーフィルタとを含む場合、ＲＧＢの各色の光源を別個に設ける場合と異なり、色が混ざることを抑制するために光源同士を仕切る構造が必要ないため、同心円照明部の構造を簡素化することができる。
［００１２］
上記第１の局面による実装基板検査装置において、好ましくは、同心円照明部は、ＲＧＢを１色ずつと、同心円の最も外側にＲＧＢのうち同心円の中心の色と同じ色とを含み、かつ、中心の色の光と最も外側の色の光とが同時に前記撮像部の撮像範囲を示す観察立体角内に包含されないＲＧＢの同心円光を照射するように構成されてい0003
Unlike the case of obtaining the inclination angle of the object, the inclination angle of the object to be inspected can be obtained with high accuracy regardless of changes in the reflectance of the object to be inspected. As a result, the state of the object to be inspected can be accurately inspected based on the inclination angle.
[0009]
In the mounted board inspection apparatus according to the first aspect, the tilt angle of the test target can be obtained with higher accuracy based on the RGB ratio that is not affected by changes in the reflectance of the test target. The state of can be inspected with higher accuracy.
[0010]
In this case, the control unit is preferably configured to obtain the tilt angle of the test target based on the RGB ratio of the test target and conversion information that converts the RGB ratio acquired in advance into a tilt angle. With this configuration, the inclination angle of the inspection object can be easily and reliably obtained by simply converting the RGB ratio of the inspection object into the inclination angle using the conversion information for converting the RGB ratio into the inclination angle.
[0011]
In the mounted board inspection apparatus according to the first aspect, preferably, the concentric illumination section includes a red light source, a green light source, and a blue light source arranged concentrically, or a white light source and a position facing the white light source. and RGB concentric color filters arranged in the . With this configuration, when the concentric illumination unit includes a red light source, a green light source, and a blue light source arranged concentrically, it is possible to easily obtain RGB concentric light in which red, green, and blue are arranged concentrically. I can do it. In addition, when a white light source and an RGB concentric color filter placed opposite the white light source are included, unlike the case where light sources for each RGB color are provided separately, the light sources are placed between each other in order to suppress mixing of colors. Since there is no need for a partitioning structure, the structure of the concentric illumination section can be simplified.
[0012]
In the mounted board inspection apparatus according to the first aspect, preferably, the concentric illumination section includes one color each of RGB, and the same color as the center color of the concentric circle among RGB at the outermost side of the concentric circle, and The light of the color and the light of the outermost color are configured to simultaneously emit RGB concentric circular light that is not included in the observation solid angle indicating the imaging range of the imaging unit.

【０００４】
る。このように構成すれば、ＲＧＢの同心円光が同心円の最も外側にＲＧＢのうち同心円の中心の色と同じ色を含むことにより、検査対象の傾斜角度測定範囲の終盤（すなわち、検査対象の傾斜角度が大きい場合）においても、複数色の明るさの変化に基づいて、検査対象の傾斜角度を精度よく取得することができる。
［００１３］
上記第１の局面による実装基板検査装置において、好ましくは、制御部は、検査対象の傾斜角度の変化が基準値以上である場合、基準値以上の傾斜角度の変化点をクラックとして検出する制御を行うように構成されている。このように構成すれば、クラックが発生した場合には、通常、クラックの両側で傾斜角度が異なるため、傾斜角度の変化点がクラックに対応することを利用して、検査対象のクラックを精度よく検出することができる。ここで、画像の暗部をクラックとして検出する方法もあるが、画像の暗部をクラックとして検出するような場合、クラックの幅が細い（たとえば１画素未満である）と、画像においてクラックを認識できないため、クラックを検出できない場合がある。一方、本構成では、傾斜角度の変化点をクラックとして検出するので、画像の暗部をクラックとして検出するような場合と異なり、クラックの幅が細く画像においてクラックを暗部として認識できない場合にも、クラックを精度よく検出することができる。
［００１４］
この場合、好ましくは、部品は、半導体ウエハチップを含み、制御部は、検査対象の傾斜角度に基づいて、半導体ウエハチップのクラックを検出する制御を行うように構成されている。このように構成すれば、クラックが発生しやすい半導体ウエハチップにおいて、クラックを精度よく検出することができる。
［００１５］
上記第１の局面による実装基板検査装置において、好ましくは、検査対象の高さ情報を計測可能な３次元計測部をさらに備え、制御部は、３次元計測部を用いて取得した実装基板の傾斜方向および部品の傾斜方向と、ＲＧＢの同心円光を用いて取得した部品の傾斜角度とに基づいて、実装基板上の部品の浮きを検出する制御を行うように構成されている。このように構成すれば、精度よく取得した検査対象の傾斜角度に基づいて、実装基板上の部品の浮きを精度よく検出することができる。0004
Ru. With this configuration, the RGB concentric circular light includes the same color as the center color of the concentric circle among RGB at the outermost side of the concentric circle, so that the end of the measurement range of the inclination angle of the inspection object (that is, the inclination angle of the inspection object) even when the angle of inclination of the object to be inspected is large), the inclination angle of the object to be inspected can be obtained with high accuracy based on the change in brightness of multiple colors.
[0013]
In the mounted board inspection apparatus according to the first aspect, preferably, the control unit performs control to detect a point of change in the tilt angle of the object to be inspected as a crack when the change in the tilt angle is equal to or greater than a reference value. is configured to do so. With this configuration, when a crack occurs, the angle of inclination is usually different on both sides of the crack, so by utilizing the fact that the point of change in the angle of inclination corresponds to the crack, the crack to be inspected can be accurately detected. can be detected. Here, there is a method to detect the dark part of the image as a crack, but when detecting the dark part of the image as a crack, if the width of the crack is narrow (for example, less than 1 pixel), the crack cannot be recognized in the image. , cracks may not be detected. On the other hand, in this configuration, the point of change in the inclination angle is detected as a crack, so unlike the case where a dark part of an image is detected as a crack, even if the width of the crack is so narrow that it cannot be recognized as a dark part in the image, a crack can be detected. can be detected with high accuracy.
[0014]
In this case, preferably, the component includes a semiconductor wafer chip, and the control unit is configured to perform control to detect cracks in the semiconductor wafer chip based on the inclination angle of the inspection target. With this configuration, cracks can be detected with high accuracy in semiconductor wafer chips where cracks are likely to occur.
[0015]
The mounted board inspection apparatus according to the first aspect preferably further includes a three-dimensional measurement section capable of measuring height information of the inspection target, and the control section is configured to control the tilt of the mounted board obtained using the three-dimensional measurement section. It is configured to perform control to detect lifting of the component on the mounting board based on the direction, the tilt direction of the component, and the tilt angle of the component obtained using RGB concentric light. With this configuration, it is possible to accurately detect lifting of components on the mounting board based on the accurately acquired inclination angle of the inspection target.

Claims

an imaging unit that images an inspection target including a mounting board on which components are mounted;
a concentric illumination unit that irradiates the inspection target with RGB concentric light in which red (R), green (G), and blue (B) are arranged concentrically;
Based on the imaging result of the imaging unit of the inspection target that has been irradiated with the RGB concentric light, the inclination angle of the inspection target is acquired, and the state of the inspection target is determined based on the acquired inclination angle of the inspection target. a control unit that performs control to inspect the
A mounted board inspection apparatus, wherein the control unit is configured to obtain an inclination angle of the inspection target based on an RGB ratio that is a ratio of red, green, and blue of the inspection target in the imaging result.

(delete)

1 . The control unit is configured to obtain a tilt angle of the test target based on an RGB ratio of the test target and conversion information that converts the RGB ratio obtained in advance into a tilt angle. The mounting board inspection device described in .

The concentric illumination unit includes a red light source, a green light source, and a blue light source arranged concentrically, or includes a white light source and an RGB concentric color filter arranged at a position facing the white light source. The mounted board inspection device according to claim 1 or 3.

The concentric circle illumination section includes one color each of RGB and the same color as the center color of the concentric circle among RGB at the outermost side of the concentric circle, and the light of the center color and the light of the outermost color are simultaneously illuminated. The mounted board inspection apparatus according to claim 1, wherein the mounted board inspection apparatus is configured to irradiate the RGB concentric light that is not included in an observation solid angle indicating an imaging range of the imaging unit.

The control unit is configured to perform control to detect a point of change in the inclination angle equal to or greater than the reference value as a crack when the change in the inclination angle of the inspection target is equal to or greater than a reference value. The mounted board inspection device according to any one of items 3 to 5.

The component includes a semiconductor wafer chip,
7. The mounted substrate inspection apparatus according to claim 6, wherein the control section is configured to perform control to detect cracks in the semiconductor wafer chip based on the inclination angle of the inspection target.

Further comprising a three-dimensional measurement unit capable of measuring height information of the inspection target,
The control unit is configured to determine the direction of inclination of the component based on the inclination direction of the mounting board and the inclination direction of the component obtained using the three-dimensional measurement unit, and the inclination angle of the component obtained using the RGB concentric circular light. The mounted board inspection apparatus according to any one of claims 1 and 3 to 7, which is configured to perform control to detect floating of the component on the mounted board.

Further comprising a three-dimensional measurement unit capable of measuring height information of the inspection target,
The control unit is configured to calculate an inclination angle of the inspection target based on an imaging result by the imaging unit of the inspection target irradiated with the RGB concentric light, and height information of the inspection target obtained by the three-dimensional measurement unit. The mounted board inspection apparatus according to any one of claims 1 and 3 to 8, wherein the mounting board inspection apparatus is configured to perform control to inspect the state of the inspection target.

The imaging unit has an imaging lens,
The mounting board according to any one of claims 1 and 3 to 9, wherein the concentric illumination unit is configured to irradiate the inspection target with the RGB concentric light using the imaging lens. Inspection equipment.

The mounted board inspection apparatus according to claim 10, wherein the imaging lens is an objective lens disposed at a position closest to the inspection target side in the imaging section.

The control unit is based on the image pickup result of the inspection target by the imaging unit that has been irradiated with the RGB concentric circular light, and the hue information of the inspection target that is obtained from the image pickup result of the inspection target that has been irradiated with white light. The mounted board inspection apparatus according to any one of claims 1 and 3 to 11, wherein the mounting board inspection apparatus is configured to obtain an inclination angle of the inspection target.

an imaging unit that images the inspection target;
a concentric illumination unit that irradiates the inspection target with RGB concentric light in which red (R), green (G), and blue (B) are arranged concentrically;
Based on the imaging result of the imaging unit of the inspection target that has been irradiated with the RGB concentric light, the inclination angle of the inspection target is acquired, and the state of the inspection target is determined based on the acquired inclination angle of the inspection target. a control unit that performs control to inspect the
An inspection apparatus, wherein the control unit is configured to obtain an inclination angle of the inspection target based on an RGB ratio that is a ratio of red, green, and blue of the inspection target in the imaging result.