JPWO2022107800A1 - - Google Patents
Info
- Publication number
- JPWO2022107800A1 JPWO2022107800A1 JP2022563795A JP2022563795A JPWO2022107800A1 JP WO2022107800 A1 JPWO2022107800 A1 JP WO2022107800A1 JP 2022563795 A JP2022563795 A JP 2022563795A JP 2022563795 A JP2022563795 A JP 2022563795A JP WO2022107800 A1 JPWO2022107800 A1 JP WO2022107800A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020193176 | 2020-11-20 | ||
PCT/JP2021/042211 WO2022107800A1 (ja) | 2020-11-20 | 2021-11-17 | 回路接続用接着剤フィルム、並びに、接続構造体及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022107800A1 true JPWO2022107800A1 (ja) | 2022-05-27 |
Family
ID=81708929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022563795A Pending JPWO2022107800A1 (ja) | 2020-11-20 | 2021-11-17 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022107800A1 (ja) |
KR (1) | KR20230109659A (ja) |
CN (1) | CN116529838A (ja) |
TW (1) | TW202240602A (ja) |
WO (1) | WO2022107800A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117242112A (zh) * | 2021-07-30 | 2023-12-15 | 积水化学工业株式会社 | 固化性树脂组合物、显示元件用密封剂、有机el显示元件用密封剂、光学粘接剂以及光学构件 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11148058A (ja) * | 1997-11-17 | 1999-06-02 | Seiko Epson Corp | 異方導電性接着剤、それを用いた液晶表示装置および電子機器 |
TW557237B (en) | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
JP4130747B2 (ja) * | 2002-03-28 | 2008-08-06 | 旭化成エレクトロニクス株式会社 | 異方導電性接着シートおよびその製造方法 |
WO2013146604A1 (ja) * | 2012-03-26 | 2013-10-03 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
JP2016162510A (ja) * | 2015-02-26 | 2016-09-05 | デクセリアルズ株式会社 | 接続構造体の製造方法、及び接続構造体 |
WO2020004513A1 (ja) * | 2018-06-26 | 2020-01-02 | 日立化成株式会社 | はんだ粒子 |
WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
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2021
- 2021-11-17 KR KR1020237019088A patent/KR20230109659A/ko unknown
- 2021-11-17 JP JP2022563795A patent/JPWO2022107800A1/ja active Pending
- 2021-11-17 CN CN202180077955.5A patent/CN116529838A/zh active Pending
- 2021-11-17 WO PCT/JP2021/042211 patent/WO2022107800A1/ja active Application Filing
- 2021-11-17 TW TW110142790A patent/TW202240602A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230109659A (ko) | 2023-07-20 |
CN116529838A (zh) | 2023-08-01 |
TW202240602A (zh) | 2022-10-16 |
WO2022107800A1 (ja) | 2022-05-27 |