JPWO2022102697A1 - - Google Patents

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Publication number
JPWO2022102697A1
JPWO2022102697A1 JP2022529571A JP2022529571A JPWO2022102697A1 JP WO2022102697 A1 JPWO2022102697 A1 JP WO2022102697A1 JP 2022529571 A JP2022529571 A JP 2022529571A JP 2022529571 A JP2022529571 A JP 2022529571A JP WO2022102697 A1 JPWO2022102697 A1 JP WO2022102697A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022529571A
Other languages
Japanese (ja)
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JP7355241B2 (ja
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Publication date
Application filed filed Critical
Publication of JPWO2022102697A1 publication Critical patent/JPWO2022102697A1/ja
Priority to JP2023087477A priority Critical patent/JP2023109966A/ja
Application granted granted Critical
Publication of JP7355241B2 publication Critical patent/JP7355241B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022529571A 2020-11-16 2021-11-11 半導体封止用樹脂組成物および半導体装置 Active JP7355241B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023087477A JP2023109966A (ja) 2020-11-16 2023-05-29 半導体封止用樹脂組成物および半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020190154 2020-11-16
JP2020190154 2020-11-16
PCT/JP2021/041498 WO2022102697A1 (ja) 2020-11-16 2021-11-11 半導体封止用樹脂組成物および半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023087477A Division JP2023109966A (ja) 2020-11-16 2023-05-29 半導体封止用樹脂組成物および半導体装置

Publications (2)

Publication Number Publication Date
JPWO2022102697A1 true JPWO2022102697A1 (ko) 2022-05-19
JP7355241B2 JP7355241B2 (ja) 2023-10-03

Family

ID=81601229

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022529571A Active JP7355241B2 (ja) 2020-11-16 2021-11-11 半導体封止用樹脂組成物および半導体装置
JP2023087477A Pending JP2023109966A (ja) 2020-11-16 2023-05-29 半導体封止用樹脂組成物および半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023087477A Pending JP2023109966A (ja) 2020-11-16 2023-05-29 半導体封止用樹脂組成物および半導体装置

Country Status (5)

Country Link
JP (2) JP7355241B2 (ko)
KR (1) KR20230107646A (ko)
CN (1) CN116457387A (ko)
TW (1) TW202225244A (ko)
WO (1) WO2022102697A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117511426B (zh) * 2024-01-05 2024-04-12 深圳市长松科技有限公司 用于封装阻隔水气的薄膜、半导体薄膜封装方法及构造

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09286613A (ja) * 1996-04-19 1997-11-04 Nippon Steel Chem Co Ltd 電子材料用高純度アルミナ及びムライトの製造方法
JPH1192136A (ja) * 1997-09-18 1999-04-06 Adomatekkusu:Kk 低α線量アルミナ粉末の製造方法および低α線量アルミナ粉末
JP2003137627A (ja) * 2001-11-05 2003-05-14 Denki Kagaku Kogyo Kk 高熱伝導性無機粉末および樹脂組成物と表面処理剤組成物
JP2014005359A (ja) * 2012-06-25 2014-01-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2014197649A (ja) * 2013-03-29 2014-10-16 株式会社アドマテックス ３次元実装型半導体装置、樹脂組成物及びその製造方法
JP2015093790A (ja) * 2013-11-11 2015-05-18 住友ベークライト株式会社 有機化合物修飾無機フィラーの製造方法および有機化合物修飾無機フィラー

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4631296B2 (ja) 2004-03-05 2011-02-16 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09286613A (ja) * 1996-04-19 1997-11-04 Nippon Steel Chem Co Ltd 電子材料用高純度アルミナ及びムライトの製造方法
JPH1192136A (ja) * 1997-09-18 1999-04-06 Adomatekkusu:Kk 低α線量アルミナ粉末の製造方法および低α線量アルミナ粉末
JP2003137627A (ja) * 2001-11-05 2003-05-14 Denki Kagaku Kogyo Kk 高熱伝導性無機粉末および樹脂組成物と表面処理剤組成物
JP2014005359A (ja) * 2012-06-25 2014-01-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2014197649A (ja) * 2013-03-29 2014-10-16 株式会社アドマテックス ３次元実装型半導体装置、樹脂組成物及びその製造方法
JP2015093790A (ja) * 2013-11-11 2015-05-18 住友ベークライト株式会社 有機化合物修飾無機フィラーの製造方法および有機化合物修飾無機フィラー

Also Published As

Publication number Publication date
JP2023109966A (ja) 2023-08-08
WO2022102697A1 (ja) 2022-05-19
KR20230107646A (ko) 2023-07-17
CN116457387A (zh) 2023-07-18
JP7355241B2 (ja) 2023-10-03
TW202225244A (zh) 2022-07-01

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