JPWO2022097659A5 - - Google Patents
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- Publication number
- JPWO2022097659A5 JPWO2022097659A5 JP2022520744A JP2022520744A JPWO2022097659A5 JP WO2022097659 A5 JPWO2022097659 A5 JP WO2022097659A5 JP 2022520744 A JP2022520744 A JP 2022520744A JP 2022520744 A JP2022520744 A JP 2022520744A JP WO2022097659 A5 JPWO2022097659 A5 JP WO2022097659A5
- Authority
- JP
- Japan
- Prior art keywords
- shielding film
- electromagnetic wave
- adhesive layer
- wave shielding
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims 12
- 239000010410 layer Substances 0.000 claims 6
- 239000000049 pigment Substances 0.000 claims 5
- 239000002923 metal particle Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000004840 adhesive resin Substances 0.000 claims 1
- 229920006223 adhesive resin Polymers 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000006229 carbon black Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Claims (10)
前記接着剤層は、接着性樹脂組成物と顔料とを含み、
前記電磁波シールドフィルムを前記接着剤層側から見た、前記接着剤層の表面のＬ＊ａ＊ｂ＊表色系におけるａ＊値は０．０１～２．５０であり、
前記接着剤層は、さらに金属粒子を含む導電性接着剤層であることを特徴とする電磁波シールドフィルム。 An electromagnetic wave shielding film in which a shield layer and an adhesive layer are laminated in order,
The adhesive layer contains an adhesive resin composition and a pigment,
When the electromagnetic wave shielding film is viewed from the adhesive layer side, the a * value in the L * a * b * color system of the surface of the adhesive layer is 0.01 to 2.50 ,
An electromagnetic wave shielding film , wherein the adhesive layer is a conductive adhesive layer further containing metal particles .
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020185123 | 2020-11-05 | ||
| JP2020185123 | 2020-11-05 | ||
| PCT/JP2021/040493 WO2022097659A1 (en) | 2020-11-05 | 2021-11-04 | Electromagnetic wave shielding film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022097659A1 JPWO2022097659A1 (en) | 2022-05-12 |
| JPWO2022097659A5 true JPWO2022097659A5 (en) | 2022-10-17 |
| JP7180033B2 JP7180033B2 (en) | 2022-11-29 |
Family
ID=81457036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022520744A Active JP7180033B2 (en) | 2020-11-05 | 2021-11-04 | electromagnetic wave shielding film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7180033B2 (en) |
| KR (1) | KR20230098792A (en) |
| CN (1) | CN116419847A (en) |
| WO (1) | WO2022097659A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100827042B1 (en) * | 2004-01-06 | 2008-05-02 | 닛폰 덴카이 가부시키가이샤 | Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter |
| JP5167181B2 (en) * | 2009-03-25 | 2013-03-21 | 大日本印刷株式会社 | Electromagnetic wave shielding filter |
| JP5743500B2 (en) | 2010-11-11 | 2015-07-01 | 藤森工業株式会社 | Electromagnetic wave shielding material for FPC |
| JP6144868B2 (en) * | 2010-11-18 | 2017-06-07 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, and flip chip semiconductor back film manufacturing method |
| JP6381117B2 (en) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film |
| CN111800997B (en) * | 2016-09-06 | 2023-08-29 | 拓自达电线株式会社 | Electromagnetic wave shielding film |
| WO2020116409A1 (en) * | 2018-12-03 | 2020-06-11 | タツタ電線株式会社 | Ground member and shielded printed wiring board |
-
2021
- 2021-11-04 KR KR1020237013028A patent/KR20230098792A/en active Search and Examination
- 2021-11-04 WO PCT/JP2021/040493 patent/WO2022097659A1/en active Application Filing
- 2021-11-04 CN CN202180071397.1A patent/CN116419847A/en active Pending
- 2021-11-04 JP JP2022520744A patent/JP7180033B2/en active Active
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