JPWO2022097659A1 - - Google Patents

Info

Publication number
JPWO2022097659A1
JPWO2022097659A1 JP2022520744A JP2022520744A JPWO2022097659A1 JP WO2022097659 A1 JPWO2022097659 A1 JP WO2022097659A1 JP 2022520744 A JP2022520744 A JP 2022520744A JP 2022520744 A JP2022520744 A JP 2022520744A JP WO2022097659 A1 JPWO2022097659 A1 JP WO2022097659A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022520744A
Other languages
Japanese (ja)
Other versions
JPWO2022097659A5 (en
JP7180033B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022097659A1 publication Critical patent/JPWO2022097659A1/ja
Publication of JPWO2022097659A5 publication Critical patent/JPWO2022097659A5/ja
Application granted granted Critical
Publication of JP7180033B2 publication Critical patent/JP7180033B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2022520744A 2020-11-05 2021-11-04 electromagnetic wave shielding film Active JP7180033B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020185123 2020-11-05
JP2020185123 2020-11-05
PCT/JP2021/040493 WO2022097659A1 (en) 2020-11-05 2021-11-04 Electromagnetic wave shielding film

Publications (3)

Publication Number Publication Date
JPWO2022097659A1 true JPWO2022097659A1 (en) 2022-05-12
JPWO2022097659A5 JPWO2022097659A5 (en) 2022-10-17
JP7180033B2 JP7180033B2 (en) 2022-11-29

Family

ID=81457036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022520744A Active JP7180033B2 (en) 2020-11-05 2021-11-04 electromagnetic wave shielding film

Country Status (4)

Country Link
JP (1) JP7180033B2 (en)
KR (1) KR20230098792A (en)
CN (1) CN116419847A (en)
WO (1) WO2022097659A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070019686A (en) * 2004-01-06 2007-02-15 닛폰 덴카이 가부시키가이샤 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter
JP2010226012A (en) * 2009-03-25 2010-10-07 Dainippon Printing Co Ltd Electromagnetic wave-shielding filter
JP2016054261A (en) * 2014-09-04 2016-04-14 信越ポリマー株式会社 Electromagnetic shield film and manufacturing method of flexible printed wiring board with the same
JP2016056370A (en) * 2010-11-18 2016-04-21 日東電工株式会社 Film for back face of flip-chip type semiconductor, film for back face of dicing tape-integrated semiconductor, and production method of film for back face of flip-chip type semiconductor
JP2018041962A (en) * 2016-09-06 2018-03-15 タツタ電線株式会社 Electromagnetic wave shield film
WO2020116409A1 (en) * 2018-12-03 2020-06-11 タツタ電線株式会社 Ground member and shielded printed wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5743500B2 (en) 2010-11-11 2015-07-01 藤森工業株式会社 Electromagnetic wave shielding material for FPC

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070019686A (en) * 2004-01-06 2007-02-15 닛폰 덴카이 가부시키가이샤 Copper foil for electromagnetic wave shield filter and electromagnetic wave shield filter
JP2010226012A (en) * 2009-03-25 2010-10-07 Dainippon Printing Co Ltd Electromagnetic wave-shielding filter
JP2016056370A (en) * 2010-11-18 2016-04-21 日東電工株式会社 Film for back face of flip-chip type semiconductor, film for back face of dicing tape-integrated semiconductor, and production method of film for back face of flip-chip type semiconductor
JP2016054261A (en) * 2014-09-04 2016-04-14 信越ポリマー株式会社 Electromagnetic shield film and manufacturing method of flexible printed wiring board with the same
JP2018041962A (en) * 2016-09-06 2018-03-15 タツタ電線株式会社 Electromagnetic wave shield film
WO2020116409A1 (en) * 2018-12-03 2020-06-11 タツタ電線株式会社 Ground member and shielded printed wiring board

Also Published As

Publication number Publication date
CN116419847A (en) 2023-07-11
TW202224551A (en) 2022-06-16
WO2022097659A1 (en) 2022-05-12
KR20230098792A (en) 2023-07-04
JP7180033B2 (en) 2022-11-29

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