JPWO2022075213A1 - - Google Patents

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Publication number
JPWO2022075213A1
JPWO2022075213A1 JP2022555438A JP2022555438A JPWO2022075213A1 JP WO2022075213 A1 JPWO2022075213 A1 JP WO2022075213A1 JP 2022555438 A JP2022555438 A JP 2022555438A JP 2022555438 A JP2022555438 A JP 2022555438A JP WO2022075213 A1 JPWO2022075213 A1 JP WO2022075213A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022555438A
Other languages
Japanese (ja)
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JP7629935B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2022075213A1 publication Critical patent/JPWO2022075213A1/ja
Application granted granted Critical
Publication of JP7629935B2 publication Critical patent/JP7629935B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022555438A 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 Active JP7629935B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020168548 2020-10-05
JP2020168548 2020-10-05
PCT/JP2021/036402 WO2022075213A1 (ja) 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2022075213A1 true JPWO2022075213A1 (enrdf_load_stackoverflow) 2022-04-14
JP7629935B2 JP7629935B2 (ja) 2025-02-14

Family

ID=81126900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555438A Active JP7629935B2 (ja) 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器

Country Status (2)

Country Link
JP (1) JP7629935B2 (enrdf_load_stackoverflow)
WO (1) WO2022075213A1 (enrdf_load_stackoverflow)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590554A (en) * 1978-12-29 1980-07-09 Toray Silicone Co Ltd Silicone-epoxy resin composition
JPS60179417A (ja) * 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
JPH06321518A (ja) * 1993-03-25 1994-11-22 Sigri Great Lakes Carbon Gmbh 金属黒鉛積層材の製造方法
JPH09296114A (ja) * 1996-04-30 1997-11-18 Denki Kagaku Kogyo Kk シリコーンゴム組成物およびその用途
JPH10189838A (ja) * 1996-12-25 1998-07-21 Siegel:Kk 熱伝導ゲル
JP2003528198A (ja) * 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2011151280A (ja) * 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
CN107325782A (zh) * 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
WO2019097852A1 (ja) * 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590554A (en) * 1978-12-29 1980-07-09 Toray Silicone Co Ltd Silicone-epoxy resin composition
JPS60179417A (ja) * 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
JPH06321518A (ja) * 1993-03-25 1994-11-22 Sigri Great Lakes Carbon Gmbh 金属黒鉛積層材の製造方法
JPH09296114A (ja) * 1996-04-30 1997-11-18 Denki Kagaku Kogyo Kk シリコーンゴム組成物およびその用途
JPH10189838A (ja) * 1996-12-25 1998-07-21 Siegel:Kk 熱伝導ゲル
JP2003528198A (ja) * 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2011151280A (ja) * 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
CN107325782A (zh) * 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
WO2019097852A1 (ja) * 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

Also Published As

Publication number Publication date
JP7629935B2 (ja) 2025-02-14
WO2022075213A1 (ja) 2022-04-14

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