JPWO2022075114A1 - - Google Patents

Info

Publication number
JPWO2022075114A1
JPWO2022075114A1 JP2022555377A JP2022555377A JPWO2022075114A1 JP WO2022075114 A1 JPWO2022075114 A1 JP WO2022075114A1 JP 2022555377 A JP2022555377 A JP 2022555377A JP 2022555377 A JP2022555377 A JP 2022555377A JP WO2022075114 A1 JPWO2022075114 A1 JP WO2022075114A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022555377A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022075114A1 publication Critical patent/JPWO2022075114A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0056—Adjusting the distance between two elements, at least one of them being movable, e.g. air-gap tuning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
JP2022555377A 2020-10-09 2021-09-28 Pending JPWO2022075114A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020171315 2020-10-09
PCT/JP2021/035505 WO2022075114A1 (ja) 2020-10-09 2021-09-28 積層構造体および積層構造体の製造方法

Publications (1)

Publication Number Publication Date
JPWO2022075114A1 true JPWO2022075114A1 (ja) 2022-04-14

Family

ID=81125924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555377A Pending JPWO2022075114A1 (ja) 2020-10-09 2021-09-28

Country Status (4)

Country Link
US (1) US20230239632A1 (ja)
JP (1) JPWO2022075114A1 (ja)
CN (1) CN116349250A (ja)
WO (1) WO2022075114A1 (ja)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008099004A (ja) * 2006-10-12 2008-04-24 Rohm Co Ltd 静電容量型センサの製造方法および静電容量型センサ
KR101411416B1 (ko) * 2007-12-14 2014-06-26 삼성전자주식회사 마이크로 스피커 제조방법 및 이 방법에 의해 제조된마이크로 스피커
JP2010114776A (ja) * 2008-11-07 2010-05-20 Toshiba Corp 音響トランスデューサ
JP5513813B2 (ja) * 2009-08-31 2014-06-04 新日本無線株式会社 Ｍｅｍｓマイクロフォンおよびその製造方法
JP5177311B1 (ja) * 2012-02-15 2013-04-03 オムロン株式会社 静電容量型センサ及びその製造方法
DE102012203900A1 (de) * 2012-03-13 2013-09-19 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur
JP6135387B2 (ja) * 2013-08-09 2017-05-31 オムロン株式会社 マイクロフォン、音響センサ及び音響センサの製造方法

Also Published As

Publication number Publication date
CN116349250A (zh) 2023-06-27
WO2022075114A1 (ja) 2022-04-14
US20230239632A1 (en) 2023-07-27

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