JPWO2022074949A1 - - Google Patents
Info
- Publication number
- JPWO2022074949A1 JPWO2022074949A1 JP2022555293A JP2022555293A JPWO2022074949A1 JP WO2022074949 A1 JPWO2022074949 A1 JP WO2022074949A1 JP 2022555293 A JP2022555293 A JP 2022555293A JP 2022555293 A JP2022555293 A JP 2022555293A JP WO2022074949 A1 JPWO2022074949 A1 JP WO2022074949A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/087—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices for sensing other physical parameters, e.g. electrical or chemical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
- B25J13/089—Determining the position of the robot with reference to its environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/02—Sensing devices
- B25J19/021—Optical sensing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1612—Programme controls characterised by the hand, wrist, grip control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Numerical Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/067,423 US11554498B2 (en) | 2020-10-09 | 2020-10-09 | Wafer jig, robot system, communication method, and robot teaching method |
PCT/JP2021/030881 WO2022074949A1 (ja) | 2020-10-09 | 2021-08-23 | ウエハ治具、ロボットシステム、通信方法、及びロボット教示方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022074949A1 true JPWO2022074949A1 (ja) | 2022-04-14 |
Family
ID=81079432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022555293A Pending JPWO2022074949A1 (ja) | 2020-10-09 | 2021-08-23 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11554498B2 (ja) |
JP (1) | JPWO2022074949A1 (ja) |
KR (1) | KR20230056771A (ja) |
CN (1) | CN116325111A (ja) |
TW (1) | TWI795940B (ja) |
WO (1) | WO2022074949A1 (ja) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3306398B2 (ja) * | 1999-11-29 | 2002-07-24 | 大日本スクリーン製造株式会社 | 基板搬送装置および搬送教示システム |
KR100763096B1 (ko) * | 2001-09-07 | 2007-10-04 | 가부시키가이샤 야스카와덴키 | 웨이퍼 위치 교시 방법 및 교시용 치구 |
JP2003165078A (ja) * | 2001-11-27 | 2003-06-10 | Kawasaki Heavy Ind Ltd | 自動教示システム |
JP4501102B2 (ja) * | 2003-10-14 | 2010-07-14 | 株式会社安川電機 | 教示治具およびそれを使って教示されるロボットおよびそのロボットの教示方法 |
JP4501103B2 (ja) * | 2003-10-17 | 2010-07-14 | 株式会社安川電機 | 半導体ウェハ搬送ロボットのキャリブレーション方法およびそれを備えた半導体ウェハ搬送ロボット、ウェハ搬送装置 |
JP4285204B2 (ja) * | 2003-11-04 | 2009-06-24 | 株式会社安川電機 | ウェハ位置教示方法およびウェハ搬送ロボット |
JP4506255B2 (ja) * | 2004-04-19 | 2010-07-21 | 株式会社安川電機 | ウェハ位置教示方法およびそのロボット |
KR20080009745A (ko) * | 2005-07-15 | 2008-01-29 | 가부시키가이샤 야스카와덴키 | 웨이퍼 위치 교시 방법 및 교시 치구 장치 |
CN102046338B (zh) * | 2008-05-27 | 2014-05-07 | 日商乐华股份有限公司 | 输送装置、位置示教方法以及传感器夹具 |
JP5347466B2 (ja) | 2008-12-09 | 2013-11-20 | 株式会社安川電機 | 教示治具によって教示する基板搬送用マニピュレータ |
JP6384195B2 (ja) * | 2014-08-20 | 2018-09-05 | 株式会社安川電機 | ロボットシステムおよびロボット教示方法 |
JP6522325B2 (ja) * | 2014-12-08 | 2019-05-29 | 日本電産サンキョー株式会社 | 産業用ロボットおよび産業用ロボットの教示方法 |
-
2020
- 2020-10-09 US US17/067,423 patent/US11554498B2/en active Active
-
2021
- 2021-08-23 WO PCT/JP2021/030881 patent/WO2022074949A1/ja active Application Filing
- 2021-08-23 CN CN202180068616.0A patent/CN116325111A/zh active Pending
- 2021-08-23 JP JP2022555293A patent/JPWO2022074949A1/ja active Pending
- 2021-08-23 KR KR1020237010482A patent/KR20230056771A/ko unknown
- 2021-10-08 TW TW110137428A patent/TWI795940B/zh active
Also Published As
Publication number | Publication date |
---|---|
US11554498B2 (en) | 2023-01-17 |
WO2022074949A1 (ja) | 2022-04-14 |
CN116325111A (zh) | 2023-06-23 |
KR20230056771A (ko) | 2023-04-27 |
US20220111534A1 (en) | 2022-04-14 |
TWI795940B (zh) | 2023-03-11 |
TW202214402A (zh) | 2022-04-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230406 |